Optimization of indium bump preparation in infrared focal plane array fabrication

Zhijin Hou; Junjie Si; Wei Wang; Haizhen Wang; Liwen Wang

doi:10.1117/12.2071086

20 November 2014 Optimization of indium bump preparation in infrared focal plane array fabrication

Zhijin Hou, Junjie Si, Wei Wang, Haizhen Wang, Liwen Wang

Proceedings Volume 9300, International Symposium on Optoelectronic Technology and Application 2014: Infrared Technology and Applications; 93000U (2014) https://doi.org/10.1117/12.2071086
Event: International Symposium on Optoelectronic Technology and Application 2014, 2014, Beijing, China

Abstract

Optimization of indium bump preparation in infrared focal plane array (IRFPA) fabrication is presented. Reasons of bringing defective pixels during conventional lift-off and cleanout process in fabrication of indium bump are discussed. IRFPAs are characterized by IRFPA test-bench. Results show that defective pixels of InSb IRFPA are owing to indium bumps connecting through indium residue on the surface of wafer. The characteristic and configuration of defective pixels of InSb IRFPA are given and analyzed. A method of reducing defective pixels through optimizing liftoff and cleanout process in InSb IRFPA is proposed. Results prove that this method is effective.

Citation Download Citation

Zhijin Hou, Junjie Si, Wei Wang, Haizhen Wang, and Liwen Wang "Optimization of indium bump preparation in infrared focal plane array fabrication", Proc. SPIE 9300, International Symposium on Optoelectronic Technology and Application 2014: Infrared Technology and Applications, 93000U (20 November 2014); https://doi.org/10.1117/12.2071086

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