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In this presentation, we discuss the integration of amorphous GaOx into back-gated transistors. The a-GaOx films (22 -100 nm) were grown by plasma-enhanced atomic layer deposition (PE-ALD). The conductivity of the films was tuned by changing the O2 plasma exposure time during the ALD cycles, which determines the content in oxygen vacancies. Back-gated transistors were fabricated with Al2O3 gate oxide on highly-doped Si substrate, with or without encapsulation of the top surface. The electrical properties of the devices will be discussed. Low sub-threshold swing (~150 mV/dec), on/off ratio >105 and operating drain voltage below 5V were obtained.
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Catherine Dubourdieu, Charlotte Van Dijck, Sourish Banerjee, Florian Maudet, Veeresh Deshpande, "Back-gated devices from amorphous GaOx grown by ALD for BEOL integration," Proc. SPIE PC12002, Oxide-based Materials and Devices XIII, PC120020G (5 March 2022); https://doi.org/10.1117/12.2620759