Presentation
17 March 2023 Thermal managment of integrated multi-emitter quantum cascade lasers platform
Author Affiliations +
Proceedings Volume PC12440, Novel In-Plane Semiconductor Lasers XXII; PC124400B (2023) https://doi.org/10.1117/12.2651551
Event: SPIE OPTO, 2023, San Francisco, California, United States
Abstract
Compact, multi-spectral laser sources emitting in the mid-infrared (mid-IR) are in high demand for applications. Integration of several multi-spectral, mid IR quantum cascade lasers on silicon-based waveguide platforms is a necessary step towards realization of functional and complex mid-infrared photonic integrated circuits. This paper focuses on the thermal aspects of integration of multi-spectral QCLs toward the integration of QCL chips on silicon-based platform. The experimental results registered by means of CCD-thermo-reflectance are supported by numerical simulations of heat dissipation. The effects of thermal cross-talk between individual emitters are presented and discussed, leading to design guidelines for placement of laser chips in mid-infrared integrated photonics systems.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dorota Pierścińska, Grzegorz Sobczak, Krzysztof Michalak, Joanna Branas, Aleksandr Kuźmicz, and Kamil Pierscinski "Thermal managment of integrated multi-emitter quantum cascade lasers platform", Proc. SPIE PC12440, Novel In-Plane Semiconductor Lasers XXII, PC124400B (17 March 2023); https://doi.org/10.1117/12.2651551
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KEYWORDS
Quantum cascade lasers

Mid-IR

CCD cameras

Silicon

Thermal effects

Thermography

Spectroscopy

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