A ML based OPC model pattern down-selection method with mask and wafer contours

Xuefeng Zeng; Yuansheng Ma; Yixiao Zhang; Yuyang Sun

doi:10.1117/12.2662778

30 April 2023 A ML based OPC model pattern down-selection method with mask and wafer contours

Xuefeng Zeng, Yuansheng Ma, Yixiao Zhang, Yuyang Sun

Proceedings Volume PC12499, Advanced Etch Technology and Process Integration for Nanopatterning XII; PC1249905 (2023) https://doi.org/10.1117/12.2662778
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

This conference presentation was prepared for the Advanced Etch Technology and Process Integration for Nanopatterning XII conference at SPIE Advanced Lithography + Patterning 2023.

Conference Presentation

Citation Download Citation

Xuefeng Zeng, Yuansheng Ma, Yixiao Zhang, and Yuyang Sun "A ML based OPC model pattern down-selection method with mask and wafer contours", Proc. SPIE PC12499, Advanced Etch Technology and Process Integration for Nanopatterning XII, PC1249905 (30 April 2023); https://doi.org/10.1117/12.2662778

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