Laser Induced Forward Transfer of metallic interconnections for photonic applications

Marina Makrygianni; Kostas Andritsos; Sohrab Kamyar; Erik Schreuder; Ronald Dekker; Ioanna Zergioti

doi:10.1117/12.3021634

20 June 2024 Laser Induced Forward Transfer of metallic interconnections for photonic applications

Marina Makrygianni, Kostas Andritsos, Sohrab Kamyar, Erik Schreuder, Ronald Dekker, Ioanna Zergioti

Proceedings Volume PC13005, Laser + Photonics for Advanced Manufacturing ; PC130050B (2024) https://doi.org/10.1117/12.3021634
Event: SPIE Photonics Europe, 2024, Strasbourg, France

Abstract

Among different technologies dealing with additive manufacturing (AM), Laser Induced Forward Transfer (LIFT) is a sustainable and precise manufacturing technology, that shows high potential for industrial application. Here, we propose the use of LIFT to efficiently print metallic patterns and solder materials on PIC chips. This study explores two donor substrates for gold deposition: evaporated gold layers on glass and gold nanoparticle inks, and one donor substrate for solder paste deposition. Parameters like layer thickness, laser scanning speed, donor-receiver gap distance, laser fluence and pulse shape are optimized for quality transfer. Optimization of the LIFT process parameters will enable the reproducible and controllable printing of electrodes for creating an all-printed graphene-based photodetector and the solder paste deposition for assembly applications.

Conference Presentation

Citation Download Citation

Marina Makrygianni, Kostas Andritsos, Sohrab Kamyar, Erik Schreuder, Ronald Dekker, and Ioanna Zergioti "Laser Induced Forward Transfer of metallic interconnections for photonic applications", Proc. SPIE PC13005, Laser + Photonics for Advanced Manufacturing , PC130050B (20 June 2024); https://doi.org/10.1117/12.3021634

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