CONFERENCE PROCEEDINGS
Advanced Search
Home > Proceedings > Volume PC13012 > Article
Presentation
19 June 2024 Additive-CMOS compatible fabrication of 3D photonic circuits towards multi-chip integration of hybrid platforms
Adrià Grabulosa i Vallmajó, Xavier Porte, Johnny Moughames, Erik Jung, Kanhaya Sharma, Daniel Brunner
Author Affiliations +
Proceedings Volume PC13012, Integrated Photonics Platforms III; (2024) https://doi.org/10.1117/12.3022005
Event: SPIE Photonics Europe, 2024, Strasbourg, France
Abstract
Combining the strength of multiple photonic and electronics concepts in one hybrid and multi-chip platform is a promising solution for the diversification of chips for specific computing tasks to boost performance. Using additive and CMOS compatible one- (OPP) and two-photon polymerization (TPP), i.e. flash-TPP printing, we create low-loss 3D integrated photonic chips for scalable and parallel interconnects, which is challenging to realize in 2D. Here, we demonstrate the CMOS compatibility of such technology by merging polymer-based 3D photonic chips with diverse photonic platforms. We interfaced 3D waveguides on top of semiconductor (GaAs) quantum dot micro-lasers, yielding very high emission collection efficiency into the waveguides at cryogenic temperatures (4 K). Furthermore, we integrated our technology with silicon-on-insulator (SOI) platforms by efficiently coupling light from 2D planar SiN waveguides into out-of-plane 3D waveguides. With this, we lay a promising foundation for scalable integration of hybrid photonic and electronic platforms.
Conference Presentation
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Citation Download Citation
Adrià Grabulosa i Vallmajó, Xavier Porte, Johnny Moughames, Erik Jung, Kanhaya Sharma, and Daniel Brunner "Additive-CMOS compatible fabrication of 3D photonic circuits towards multi-chip integration of hybrid platforms", Proc. SPIE PC13012, Integrated Photonics Platforms III, (19 June 2024); https://doi.org/10.1117/12.3022005
ACCESS THE FULL ARTICLE
ORGANIZATIONAL
Sign in with credentials provided by your organization.
INSTITUTIONAL
Select your institution to access the SPIE Digital Library.
SELECT YOUR INSTITUTION
PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
PERSONAL SIGN IN
No SPIE Account? Create one
PURCHASE THIS CONTENT
SUBSCRIBE TO DIGITAL LIBRARY
50 downloads per 1-year subscription
Members: $195
Non-members: $335 ADD TO CART
25 downloads per 1 - year subscription
Members: $145
Non-members: $250 ADD TO CART
PURCHASE SINGLE ARTICLE
Includes PDF, HTML & Video, when available
Members: $17.00
Non-members: $21.00 ADD TO CART
PROCEEDINGS
 PRESENTATION
WATCH
PRESENTATION SAVE TO MY LIBRARY
GET CITATION
Advertisement
Advertisement
KEYWORDS
Fabrication
Photonic integrated circuits
Waveguides
3D printing
CMOS technology
Integrated optics
Quantum dot emission
RELATED CONTENT
Subscribe to Digital Library
Receive Erratum Email Alert
Back to Top