Novel automated microassembly mechanism based on on-chip actuators

Yuan Xue; Siyuan He

doi:10.1117/1.JMM.12.1.013003

17 January 2013 Novel automated microassembly mechanism based on on-chip actuators

Yuan Xue, Siyuan He

Author Affiliations +

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 12, Issue 1, 013003 (January 2013). https://doi.org/10.1117/1.JMM.12.1.013003

Abstract

The development of a novel automated microassembly mechanism based on on-chip actuators is described. The assembly mechanism utilizes repulsive-force actuators to flip surface-micromachined two-dimensional structures out-of-plane and assemble them in a vertical position. The assembly mechanism is suitable for wafer-level multidevice batch assembly without external interference. Prototypes were fabricated using the PolyMUMPs surface micromachining technology, then tested. The strength of the assembled structures in terms of withstanding external acceleration was calculated and experimentally measured. The measured results showed the assembly strength of 7 g for prototype 1 and 8 to 11 g for prototype 2.

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Yuan Xue and Siyuan He "Novel automated microassembly mechanism based on on-chip actuators," Journal of Micro/Nanolithography, MEMS, and MOEMS 12(1), 013003 (17 January 2013). https://doi.org/10.1117/1.JMM.12.1.013003

Published: 17 January 2013

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