Microfluidic simulations for immersion lithography

Alexander C. Wei; Gregory F. Nellis; Amr Y. Abdo; Roxann L. Engelstad; Cheng-Fu Chen; Michael Switkes; Mordechai Rothschild

doi:10.1117/1.1632500

1 January 2004 Microfluidic simulations for immersion lithography

Alexander C. Wei, Gregory F. Nellis, Amr Y. Abdo, Roxann L. Engelstad, Cheng-Fu Chen, Michael Switkes, Mordechai Rothschild

Author Affiliations +

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 3, Issue 1, (January 2004). https://doi.org/10.1117/1.1632500

Abstract

The premise behind immersion lithography is to improve resolution by increasing the index of refraction in the space between the final projection lens of an exposure system and the device wafer by inserting a high-index liquid in place of the low-index air that currently fills the gap. We present a preliminary analysis of the fluid flow characteristics of a liquid between the lens and the wafer. The objectives of this feasibility study are to identify liquid candidates that meet the fluid mechanical requirements and to verify modeling tools for immersion lithography. The filling process was analyzed to simplify the problem and identify important fluid properties and system parameters. Two-dimensional computational fluid dynamics (CFD) models of the fluid between the lens and the wafer are developed and used to investigate a passive technique for filling this gap, in which a liquid is dispensed onto the wafer as a puddle, and then the wafer and liquid move under the lens. Numerical simulations include a parametric study of the key dimensionless groups influencing the filling process, and an investigation of the effects of the fluid/wafer and fluid/lens contact angles and wafer direction. The model results are compared with experimental measurements.

©(2004) Society of Photo-Optical Instrumentation Engineers (SPIE)

Citation Download Citation

Alexander C. Wei, Gregory F. Nellis, Amr Y. Abdo, Roxann L. Engelstad, Cheng-Fu Chen, Michael Switkes, and Mordechai Rothschild "Microfluidic simulations for immersion lithography," Journal of Micro/Nanolithography, MEMS, and MOEMS 3(1), (1 January 2004). https://doi.org/10.1117/1.1632500

Published: 1 January 2004

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

;

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE