Open Access
2 February 2016 Optimization of surface-mount-device light-emitting diode packaging: investigation of effects of component optical properties on light extraction efficiency
Tomoaki Kashiwao, Mayu Hiura, Yee Yan Lim, Alireza Bahadori, Kenji Ikeda, Mikio Deguchi
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Abstract
An investigation of the effects of the optical properties of surface-mount-device (SMD) light-emitting diode (LED) (side-view and top-view LEDs) packaging (PKG) components on the light extraction efficiency ηPKG using ray-tracing simulations is presented. In particular, it is found that the optical properties of the PKG resin and the lead-frame (L/F) silver-plating significantly affect ηPKG. Thus, the effects of the surface reflection methods of these components are investigated in order to optimize the optical design of the LED PKG. It is shown that there exists peak extraction efficiency for each PKG, and the cavity angle formed by the cavity wall is important to the optical design. In addition, the effect of phosphor present in the mold resin is examined using a Mie scattering simulation. Finally, an SMD LED PKG optical design method is proposed on the basis of the simulation results.
CC BY: © The Authors. Published by SPIE under a Creative Commons Attribution 4.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.
Tomoaki Kashiwao, Mayu Hiura, Yee Yan Lim, Alireza Bahadori, Kenji Ikeda, and Mikio Deguchi "Optimization of surface-mount-device light-emitting diode packaging: investigation of effects of component optical properties on light extraction efficiency," Optical Engineering 55(2), 025101 (2 February 2016). https://doi.org/10.1117/1.OE.55.2.025101
Received: 10 September 2015; Accepted: 28 December 2015; Published: 2 February 2016
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Light emitting diodes

Reflection

Optical properties

Packaging

Reflectivity

Optical design

Absorption

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