Elastic memory composites (EMC) for deployable industrial and commercial applications

Steven C. Arzberger; Michael L. Tupper; Mark S. Lake; Rory Barrett; Kaushik Mallick; Craig Hazelton; William Francis; Phillip N. Keller; Douglas Campbell; Sara Feucht; Dana Codell; Joe Wintergerst; Larry Adams; Joe Mallioux; Rob Denis; Karen White; Mark Long; Naseem A. Munshi; Ken Gall

doi:10.1117/12.600583

5 May 2005 Elastic memory composites (EMC) for deployable industrial and commercial applications

Steven C. Arzberger, Michael L. Tupper, Mark S. Lake, Rory Barrett, Kaushik Mallick, Craig Hazelton, William Francis, Phillip N. Keller, Douglas Campbell, Sara Feucht, Dana Codell, Joe Wintergerst, Larry Adams, Joe Mallioux, Rob Denis, Karen White, Mark Long, Naseem A. Munshi, Ken Gall

Author Affiliations +

Proceedings Volume 5762, Smart Structures and Materials 2005: Industrial and Commercial Applications of Smart Structures Technologies; (2005) https://doi.org/10.1117/12.600583
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2005, San Diego, California, United States

Abstract

The use of smart materials and multifunctional components has the potential to provide enhanced performance, improved economics, and reduced safety concerns for applications ranging from outer space to subterranean. Elastic Memory Composite (EMC) materials, based on shape memory polymers and used to produce multifunctional components and structures, are being developed and qualified for commercial use as deployable components and structures. EMC materials are similar to traditional fiber-reinforced composites except for the use of a thermoset shape memory resin that enables much higher packaging strains than traditional composites without damage to the fibers or the resin. This unique capability is being exploited in the development of very efficient EMC structural components for deployable spacecraft systems as well as capability enhancing components for use in other industries. The present paper is intended primarily to describe the transition of EMC materials as smart structure technologies into viable industrial and commercial products. Specifically, the paper discusses: 1) TEMBO EMC materials for deployable space/aerospace systems, 2) TEMBO EMC resins for terrestrial applications, 3) future generation EMC materials.

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Steven C. Arzberger, Michael L. Tupper, Mark S. Lake, Rory Barrett, Kaushik Mallick, Craig Hazelton, William Francis, Phillip N. Keller, Douglas Campbell, Sara Feucht, Dana Codell, Joe Wintergerst, Larry Adams, Joe Mallioux, Rob Denis, Karen White, Mark Long, Naseem A. Munshi, and Ken Gall "Elastic memory composites (EMC) for deployable industrial and commercial applications", Proc. SPIE 5762, Smart Structures and Materials 2005: Industrial and Commercial Applications of Smart Structures Technologies, (5 May 2005); https://doi.org/10.1117/12.600583

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