Background: Reliable photomask metrology is required to reduce the risk of yield loss in the semiconductor manufacturing process as well as for the research on absorber materials. Actinic pattern inspection (API) of EUV reticles is a challenging problem to tackle with a conventional approach. For this reason, we developed RESCAN, an API platform based on coherent diffraction imaging.

Aim: We want to verify the sensitivity of our platform to absorber and phase defects.

Approach: We designed and manufactured two EUV mask samples with absorber and phase defects, and we inspected them with RESCAN in die-to-database mode.

Results: We reconstructed an image of an array of programmed absorber defects, and we created a defect map of our sample. We inspected two programmed phase defect samples with buried structures of 3.5 and 7.8 nm height.

Conclusions: We verified that RESCAN, in its current configuration, can detect absorber defects in random patterns and buried (phase) defects down to 50  ×  50  nm².