Recently several attempts by using transfer printing method for integration of on-chip laser into silicon circuit. These approaches can minimize wasted III-V areas but has the disadvantage of requiring high alignment tolerances. Here, we propose a new concept of hybrid silicon laser, which is high tolerable in alignment. Employing the whispering gallery mode laser in conjunction with III-V patch layer, designed hybrid micro-patch laser has high design flexibility, and lower the process difficulty in fabrication. We expect the hybrid micro-patch laser to be the next generation device of on-chip micro-lasers.
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