An increasing demand in performance from electronic devices has resulted in continuous shrinking of electronic components. This shrinkage has demanded that the primary integration platform, the printed circuit board (PCB), follow this same trend. Today, PCB companies offer ~100 micron sized features (depth and width) which mean they are becoming suitable as physical platforms for Lab-on-a-Chip (LOC) and microfluidic applications. Compared to current lithographic based fluidic approaches; PCB technology offers several advantages that are useful for this technology. These include: Being easily designed and changed using free software, robust structures that can often be reused, chip layouts that can be ordered from commercial PCB suppliers at very low cost (1 AUD each in this work), and integration of electrodes at no additional cost. Here we present the application of PCB technology in connection with microfluidics for several biomedical applications. In case of commercialization the costs for each device can be even further decreased to approximately one tenth of its current cost.
Here we present a technique to integrate bottom-up nanostructures for optoelectronic and chemoresistive sensing using an AC electrical field. The work focuses mainly on two types of nanostructured materials: gold nanoparticle and silicon nanowire. In terms of electrical microintegration of these structures, it is especially important to apply a reliable electrical contact with low contact-resistance, in order to be able to use them as optoelectronic or chemo resistive sensors. To achieve this, a micro integration process was developed to achieve this goal. The contacted nanostructures were characterized electrically to optimize the integration procedure and acquire best possible sensing capabilities. Silicon nanowires were demonstrated to work as wavelength sensitive optical sensors and gold nanoparticle as marker free chemo resistive sensor.
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