Recent advances in immersion lithography have created the need for a small field microstepper to carry out the early learning necessary for next generation device application. Combined with fluid immersion, multiple-beam lithography can provide an opportunity to explore lithographic imaging at oblique propagation angles and extreme NA imaging. Using the phase preserving properties of Smith Talbot interferometry, the Amphibian XIS immersion lithography microstepper has been created for research and development applications directed toward sub-90nm patterning. The system has been designed for use at ArF and KrF excimer laser wavelengths, based on a fused silica or sapphire prism lens with numerical aperture values up to 1.60. Combined with a chromeless phase grating mask, two and four beam imaging is made possible for feature resolution to 35nm. The approach is combined with X-Y staging to provide immersion imaging on a microstepper platform for substrates ranging up to 300mm. The Amphibian system consists of single or dual wavelength sources (193nm and 248nm), a 2mm exposure field size, stage accuracy better than 1 um, polarization control over a full range from linear polarization to unpolarized illumination, full control of exposure dose and demodulation (to synthesize defocus), and the ability to image both line patterns as well as contact features. A fluid control system allows use of water or alternative fluids, with the ability to change fluids rapidly between wafers. The Amphibian system is fully enclosed in a HEPA and amine controlled environment for use in fab or research environments.
Interference lithography has been widely utilized as a tool for the evaluation of photoresist materials, as well as emerging resolution enhancement techniques such as immersion lithography. The interferometric approach is both simple and inexpensive to implement, however it is limited in its ability to examine the impact of defocus due to the inherently large DOF (Depth-of-Focus) in two-beam interference. Alternatively, the demodulation of the aerial image that occurs as a result of defocus in a projection system may be synthesized using a two pass exposure with the interferometric method. The simulated aerial image modulation for defocused projection systems has been used to calculate the single beam exposure required to reproduce the same level of modulation in an interferometric system through the use of a “Modulation Transfer Curve”. The two methods have been theoretically correlated, by way of modulation for projection illumination configurations, including quadrupole and annular. An interferometric exposure system was used to experimentally synthesize defocus for modulations of 0.3, 0.5, 0.7 and 1.0. Feature sizes of 90nm were evaluated across dose and synthetic focus.
Immersion lithography has become attractive since it can reduce critical dimensions by increasing numerical aperture (NA) beyond unity. Among all the candidates for immersion fluids, those with higher refractive indices are desired. However, for many of the fluids, the strong absorption at 193nm becomes a serious problem. Therefore, it is essential to find a fluid that is transparent enough (with absorbance less than 0.5mm-1) and has high refractive index (above water, 1.44) at 193nm. Characterization of various fluid candidates has been performed and the absorbance of these fluids has been measured. To measure the absolute refractive index, a prism deviation angle method was developed. This method offers the possibility of measuring fluid refractive indices accurately. This paper also presents the obtained refractive indices of these fluids. Several candidates have been identified for 193nm application with refractive indices near 1.55, which is about 0.1 higher than that of water at this wavelength. Cauchy parameters of these fluids were generated and approaches were investigated to tailor the fluid absorption edges to be close to 193nm. The effects of these fluids on photoresist performance were also examined with 193nm immersion lithography exposure at various NA's. 1.5 NA was obtained to image 32nm lines with phosphoric acid as the immersion medium. These fluids are potential candidates for immersion lithography technology.
Photoresist modulation curves are introduced as a quantitative way to characterize the photoresist process performance when used as a detector in a microlithographic system. The new method allows predicting exposure latitude of the photoresist process across a wide range of resolutions and modulation levels of the aerial image. The data collection process is demonstrated using an immersion interference system, capable of variable resolution and full control over the modulation of the delivered aerial image.
A Talbot interference immersion lithography system that uses a compact prism is presented. The use of a compact prism allows the formation of a fluid layer between the optics and the image plane, enhancing the resolution. The reduced dimensions of the system alleviate coherence requirements placed on the source, allowing the use of a compact ArF excimer laser. Photoresist patterns with a half pitch of 45 nm were formed at an effective NA of 1.05. In addition, a variable NA immersion interference system was used to achieve an effective NA of 1.25. The smallest half-pitch of the photoresist pattern produced with this system was 38 nm.
The objective of this paper is to study the polarization induced by mask structures. Rigorous coupled-wave analysis (RCWA) was used to study the interaction of electromagnetic waves with mask features. RCWA allows the dependence of polarization effects of various wavelengths of radiation on grating pitch, profile, material, and thickness to be studied. The results show that for the five different mask materials examined, the material properties, mask pitch, and illumination all have a large influence on how the photomask polarizes radiation.
As immersion nanolithography gains acceptance for next generation device applications, experimental data becomes increasingly important. The behavior of resist materials, fluids, coatings, sources, and optical components in the presence of a water immersion media presents conditions unique compared to convention “dry” lithography. Several groups have initiated fundamental studies into the imaging, fluids, contamination, and integration issues involved with water immersion lithography at 193nm. This paper will present the status and results of the next stage of the development efforts carried out at RIT. The status of two systems are presented; a small field projection microstepper utilizing a 1.05 catadioptric immersion objective lens and a 0.50 to 1.26NA interferometric immersion exposure system based on a compact Talbot prism lens design. Results of the fundamental resolution limits of resist materials and of imaging optics are presented. Additionally, an exploration into the benefits of increasing the refractive index of water is addressed through the use of sulfate and phosphate additives. The potential of KrF, 248nm immersion lithography is also presented with experimental resist imaging results.
The aerial image attained from an optical projection photolithography system is ultimately limited by the frequency information present in the pupil plane of the objective lens. Careful examination of the frequency distribution will allow the operation of such a system to be synthesized experimentally through the use of interferometric lithography. Synthesis is accomplished through single beam attenuation in a two-beam interference system, which is equivalent to adjusting the relative intensities of the primary diffraction orders in a projection system. Typical lithography conditions, such as defocus and partial coherence, can be synthesized efficiently using this technique. The metric of contrast has been utilized to assess the level of correlation between defocus in a projection system and interferometric synthesis. Simulations have shown that interferometric lithography can approximate the performance of a variety of projection system configurations with a significantly high degree of accuracy.
Historically, the application of immersion optics to microlitho-graphy has not been seriously pursued because of the alternative technologies available. As the challenges of shorter wavelength become increasingly difficult, immersion imaging becomes more feasible. We present results from research into 193-nm excimer laser immersion lithography at extreme propagation angles. This is being carried out in a fluid that is most compatible in a manufacturable process, namely water. By designing a system around the optical properties of water, we are able to image with wavelengths down to 193 nm. Measured absorption is below 0.50 cm−1 at 185 nm and below 0.05 cm−1 at 193 nm. Furthermore, through the development of oblique angle imaging, numerical apertures approaching 1.0 in air and 1.44 in water are feasible. The refractive index of water at 193 nm allows for exploration of the following: k1 values near 0.25 leading to half-pitch resolution approaching 35 nm at a 193-nm wavelength; polarization effects at oblique angles (extreme NA); immersion and photoresist interactions with polarization; immersion fluid composition, temperature, flow, and micro-bubble influence on optical properties (index, absorption, aberration, birefringence); mechanical requirements for imaging, scanning, and wafer transport in a water media; and synthesizing conventional projection imaging via interferometric imaging.
It is possible to extend optical lithography by using immersion imaging methods. Historically, the application of immersion optics to microlithography has not been seriously pursued because of the alternative solutions available. As the challenges of shorter wavelength become increasingly difficult, immersion imaging becomes more feasible. We present results from research into 193nm excimer laser immersion lithography at extreme propagation angles (such as those produces with strong OAI and PSM). This is being carried out in a fluid that is most compatible in a manufacturable process, namely water. By designing a system around the optical properties of water, we are able to image with wavelengths down to 193nm. Measured absorption is below 0.50 cm-1 at 185nm and below 0.05 cm-1 at 193nm. Furthermore, through the development of oblique angle imaging, numerical apertures approaching 1.0 in air and 1.44 in water are feasible. The refractive index of water at 193nm (1.44) allows for exploration of the following: 1. k1 values approaching 0.17 and optical lithography approaching 35nm. 2. Polarization effects at oblique angles (extreme NA). 3. Immersion and photoresist interactions with polarization. 4. Immersion fluid composition, temperature, flow, and micro-bubble influence on optical properties (index, absorption, aberration, birefringence). 5. Mechanical requirements for imaging, scanning, and wafer transport in a water media. 6. Synthesizing conventional projection imaging via interferometric imaging.
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