MAPPER Lithography is developing a maskless lithography technology based on massively-parallel electron-beam
writing. In order to reduce costs and to minimize the footprint of this tool a new alignment sensor has been developed;
based on technologies used for DVD optical heads. A wafer with an alignment mark is scanned with the sensor, resulting
in an intensity pattern versus position. From this pattern the mark position can be calculated.
Evaluations have been made over the performance of this type of sensor using different mark designs at several
lithography process steps for FEOL and BEOL manufacturing. It has been shown that sub-nanometer reproducibility
(3σ std) of alignment mark readings can be achieved while being robust against various process steps.
An inspection system is developed to replace manual inspection in a production line for car parts. The system, based on projected structured light, combining Gray code and phase shifting and using B/W CCD cameras and multi-media data projectors, provides robust height measurement images with a high resolution. By carefully observing a number of parameters, it is possible to attain this high resolution in a large measurement volume even with low-cost, off-the-shelf components. We have been able to achieve a noise floor in the phase determination of 30 mrad, which is better than the much reported 1 part in 10,000. The use of 4 cameras, 3 projectors and a turning operation allows total coverage of the complex shape part.
A model of normal parts is designed using height measurement images of normal parts. This model represents both expected part dimensions in all camera views as well as normal variations. In order to compare measurements of new parts with the model, an alignment of the images is performed. The deviations between the measured part and the model are analyzed. Deviations outside the normal variation are classified as faults. The system is thus able to find geometrical faults as small as 2x2x0.25 mm in a part that measures roughly 400x400 mm and can decide whether or not to remove a part from the production line. Integrating optical metrology, image processing and robotics, we are able to design a complete system for in-line inspection of car parts with total coverage that is able to keep up with the production cycle time.
An industrial 3D laser scanner is presented for measurement of solder paste screening quality in an automated PCB assembly line. The scanner provides telecentric illumination and imaging in a 305 mm (12') long scan line at a maximum rate of more than 1000 scans per second. Synchronized height measurement is performed using a double triangulation scheme at large angles and wide aperture. Pixel sizes range down to 18 micrometers , yielding more than 16,000 pixels in a scan line. Depth resolution is 10 micrometers over a 2.5 mm measuring range. Some practical details on scanner assembly will be discussed. Combined with accurate, fast processing and control electronics this 3D sensor enables 100% inspection at high production speeds.
A new industrial 3D laser scanner is presented for measurement of solder paste screening quality in an automated PCB assembly line. Its unique scan optics provide telecentric illumination and imaging on a long scan line of 305 mm (12') at a maximum rate of more than 1000 scans per second. Synchronized height measurement is performed using a double triangulation scheme at large angles and wide aperture by means of a confocal like design based on elliptical mirrors. Using a spot size of 20 micrometers multiplied by 30 micrometers (FWHM), lateral resolution can be set electronically down to 10 micrometers pixel size. Depth resolution is 10 micrometers over a 2.5 mm measuring range. Combined with accurate and fast processing and control electronics this 3D sensor enables full 100% inspection at production speed.
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