Fumiko Iwao
at Tokyo Electron AT Ltd
SPIE Involvement:
Author
Publications (9)

Proceedings Article | 20 March 2015 Paper
Mark Somervell, Takashi Yamauchi, Soichiro Okada, Tadatoshi Tomita, Takanori Nishi, Shinichiro Kawakami, Makoto Muramatsu, Etsuo Iijima, Vinayak Rastogi, Takeo Nakano, Fumiko Iwao, Seiji Nagahara, Hiroyuki Iwaki, Makiko Dojun, Koichi Yatsuda, Toshikatsu Tobana, Ainhoa Romo Negreira, Doni Parnell, Benjamen Rathsack, Kathleen Nafus, Jean-Luc Peyre, Takahiro Kitano
Proceedings Volume 9425, 94250Q (2015) https://doi.org/10.1117/12.2085776
KEYWORDS: Etching, Semiconducting wafers, Optical lithography, Polymethylmethacrylate, Line edge roughness, Manufacturing, Image processing, Ecosystems, Line width roughness, Directed self assembly

Proceedings Article | 20 March 2012 Paper
Proceedings Volume 8325, 832525 (2012) https://doi.org/10.1117/12.916326
KEYWORDS: Etching, Silica, System on a chip, Photoresist processing, Photomasks, Extreme ultraviolet lithography, Scanning electron microscopy, Line edge roughness, Carbon, Particles

Proceedings Article | 8 April 2011 Paper
Proceedings Volume 7969, 79692E (2011) https://doi.org/10.1117/12.878730
KEYWORDS: Coating, Semiconducting wafers, Contamination, Extreme ultraviolet, Data modeling, Calibration, Extreme ultraviolet lithography, Scanning electron microscopy, Etching, Thin films

Proceedings Article | 30 March 2010 Paper
Yoshihiro Kondo, Atsushi Ookouchi, Toyohisa Tsuruda, Masahiro Yamamoto, Takasi Saito, Tsuyoshi Shibata, Satoru Shimura, Fumiko Iwao, Ben Rathsack, Michael Carcasi
Proceedings Volume 7639, 76390X (2010) https://doi.org/10.1117/12.846497
KEYWORDS: Photoresist processing, Line width roughness, Etching, Semiconducting wafers, Double patterning technology, Diffusion, Image processing, Thin film coatings, Critical dimension metrology, Particles

Proceedings Article | 11 December 2009 Paper
Hidetami Yaegashi, Eiichi Nisimura, Kazuhide Hasebe, Tetsu Kawasaki, Masato Kushibiki, Arisa Hara, Shoichi Yamauchi, Sakurako Natori, Nakajima Shigeru, Hiroki Murakami, Kazuo Yabe, Satoru Shimura, Fumiko Iwao, Kenichi Oyama
Proceedings Volume 7520, 75201E (2009) https://doi.org/10.1117/12.839826
KEYWORDS: Double patterning technology, Photoresist processing, Silica, Resolution enhancement technologies, Photoresist materials, Etching, Line width roughness, Lithography, Atomic layer deposition, Optical lithography

Proceedings Article | 1 April 2009 Paper
Hidetami Yaegashi, M. Kushibiki, E. Nishimura, S. Shimura, F. Iwao, T. Kawasaki, K. Hasebe, H. Murakami, A. Hara, K. Yabe
Proceedings Volume 7273, 72732H (2009) https://doi.org/10.1117/12.814126
KEYWORDS: Line width roughness, Etching, Double patterning technology, Silica, Photomasks, Scanners, Lithography, Optical lithography, Chemical vapor deposition, Overlay metrology

Proceedings Article | 1 April 2009 Paper
Fumiko Iwao, Satoru Shimura, Tetsu Kawasaki, Masato Kushibiki, Nishimura Eiichi
Proceedings Volume 7273, 72730G (2009) https://doi.org/10.1117/12.814365
KEYWORDS: Photoresist processing, Double patterning technology, Line width roughness, Etching, Optical lithography, Immersion lithography, Photoresist materials, Semiconducting wafers, Lithography, Extreme ultraviolet lithography

Proceedings Article | 15 April 2008 Paper
Satoru Shimura, Fumiko Iwao, Tetsu Kawasaki, Dunn Shannon, Yoshitsugu Tanaka, Hidetami Yaegashi, Yoshiaki Yamada
Proceedings Volume 6923, 69233C (2008) https://doi.org/10.1117/12.771867
KEYWORDS: Double patterning technology, Photoresist processing, Immersion lithography, Resistance, Extreme ultraviolet, Optical lithography, Thin film deposition, Semiconductors, 193nm lithography, Lithography

Proceedings Article | 26 March 2008 Paper
Tetsu Kawasaki, Satoru Shimura, Fumiko Iwao, Eiichi Nishimura, Masato Kushibiki, Kazuhide Hasebe, Michael Carcasi, Mark Somervell, Steven Scheer, Hidetami Yaegashi
Proceedings Volume 6923, 692333 (2008) https://doi.org/10.1117/12.771907
KEYWORDS: Reactive ion etching, Chemical vapor deposition, Semiconductors, Lithography, Immersion lithography, Etching, 193nm lithography, Photoresist processing, Photoresist materials, Double patterning technology

Showing 5 of 9 publications
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