As processes become more complex, and more operations are needed to fabricate individual levels in a sem iconductor chip, the ability to leverage the wealth of information to fully monitor and control the process has become of critica l importance. In this work we extend the application of design-aware fabrication process models to more operations. While one could expect that the process models become more accurate with respect to the target of interest, one of the main benefits of applying this technique is that it further decouples the individual influences that every process step imposes to different designs at different stages of the fabrication process. These results have significant implications on how this methodology can be used to improve process monitoring, a nd in the future extend to process optimization and design specific process control.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.