Since the design nodes gradually decreased and EUV production became reality, the data volume is continuously increasing due to Hard OPC & Flare Correction. Multi-Beam Mask Writers (MBMW) enabled mask exposures with curvilinear and circle pattern that have not been possible before. This soon led to an increase in the number of vertexes of design data and an increase in Mask Data Preparation turnaround times (MDP TAT). A data flow based on the newly developed MBW-2 file format was developed jointly with Nippon Control System and IMS nanofabrication and significantly improved MDP TAT. The effect was confirmed by verifying it with actual data using large-volume data and curvilinear data EUV masks exposed on MBMW. In addition, the MDP TAT was further improved by studying file write method. In this paper, we introduce the concept and application of the new data flow. Furthermore we will present the results on TAT and output file sizes. Finally, we will discuss each step in the data flow in detail.
The transition to curvilinear mask ILT might significantly increase layout complexity, posing a substantial challenge for data transfer and storage systems as file sizes explode. Traditionally, multi-beam mask writers (MBMW) have been using a mask data format (OASIS.MBW 1.0/1.2) derived from OASIS P44, leading to multi-terabyte layouts. IMS presented OASIS.MBW 2.1 as an efficient data format for curvilinear ILT masks. Since then, the development has been focused on reducing the file size further while simultaneously ensuring that IT equipment inside the fabs may handle the increased workload as demanded by storage-efficient file formats. In this paper, we propose a further possible solution to the file-format question (OASIS.MBW 2.2) taking into account corrections and requirements of leading-edge most advanced nodes. With that, we collate other file formats and explore their weaknesses and benefits.
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