Dr. James Jiahua Yu Profile

Dr. James Jiahua Yu

Senior Process Engineer at Applied Materials Inc

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Publications (4)

Proceedings Article | 4 March 2010 Paper

Self-aligned double patterning process for 32/32nm contact/space and beyond using 193 immersion lithography

Bencherki Mebarki, Liyan Miao, Yongmei Chen, James Yu, Pokhui Blanco, James Makeeff, Jen Shu, Christopher Bencher, Mehul Naik, Christopher Sui Wing Ngai

Proceedings Volume 7640, 764023 (2010) https://doi.org/10.1117/12.862583

KEYWORDS: Double patterning technology, Photomasks, Etching, Optical lithography, Immersion lithography, Silicon, Extreme ultraviolet lithography, 193nm lithography, Lithography, Oxides

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Proceedings Article | 16 March 2009 Paper

Demonstration of 32nm half-pitch electrical testable NAND FLASH patterns using self-aligned double patterning

Shiyu Sun, Chris Bencher, Yongmei Chen, Huixiong Dai, Man-Ping Cai, Jaklyn Jin, Pokhui Blanco, Liyan Miao, Ping Xu, Xumou Xu, James Yu, Raymond Hung, Shiany Oemardani, Osbert Chan, Chorng-Ping Chang, Chris Ngai

Proceedings Volume 7274, 72740D (2009) https://doi.org/10.1117/12.814403

KEYWORDS: Lithography, Resistance, Etching, Double patterning technology, Photomasks, Optical lithography, Scanning electron microscopy, Oxides, Photoresist materials, Line edge roughness

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Proceedings Article | 15 April 2008 Paper

A lithographic and process assessment of photoresist stabilization for double-patterning using 172-nm photoresist curing

Nikolaos Bekiaris, Hiram Cervera, Junyan Dai, Ryoung-han Kim, Alden Acheta, Thomas Wallow, Jongwook Kye, Harry Levinson, Thomas Nowak, James Yu

Proceedings Volume 6923, 692321 (2008) https://doi.org/10.1117/12.774205

KEYWORDS: Photoresist processing, Photoresist materials, Double patterning technology, Ultraviolet radiation, Floods, Lithography, Semiconducting wafers, Optical lithography, Coating, Printing

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Proceedings Article | 22 March 2008 Paper

Metrology characterization for self-aligned double patterning

Ami Berger, Sergey Latinsky, Maayan Bar-Zvi, Ram Peltinov, Jen Shu, Chris Ngai, James Yu, Huixiong Dai

Proceedings Volume 6922, 692211 (2008) https://doi.org/10.1117/12.774408

KEYWORDS: Line edge roughness, Etching, Semiconducting wafers, Scanning electron microscopy, Double patterning technology, Metrology, Line width roughness, Edge roughness, Process control, Critical dimension metrology

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