In recent years, research using Mixed Reality (MR) has attracted attention in the medical field, especially in radiology, where data captured by X-ray CT and MRI can be represented in 3D and combined with real space to aid diagnosis and simulate surgery. On the other hand, surface and volume rendering are mainly used for 3D rendering. It is difficult to grasp the internal structure only from the rendered data due to differences in rendering thresholds, and the information displayed is different from that of Multi-Planar Reconstruction (MPR) images as shown in 2D, so it is difficult to grasp the internal structure only from the rendered data. Also, general three-plane MPR images of sagittal, axial, and coronal sections differ from the practitioner's viewpoint when looking at the patient. This study aims to represent the 2D MPR image according to the viewpoint direction from which the practitioner views the patient and represents them in MR real-time. In the experiment, the system being proposed uses a head-mounted display (HMD) equipped with a camera see-through function that calculates the angle at which the practitioner views the patient utilizing the bed position as the central coordinate, generates MPR images from DICOM according to that angle, and displays them superimposed on the real space. As a result, the practitioner could check the internal structures of the patient's body according to their viewpoint direction with MPR images in MR.
A large-area photon-counting X-ray flat-panel detector with 100-µm pixel pitch using CdTe has been developed, using 0.75-mm-thick diode-type CdTe, connected to an 80-µm square area ultra-low-power photon-charge counting readout circuit, and 96 × 96 pixels. The 12 x 12 modules (9.6 mm square) are tiled to realize a large-area FPD of approximately 4.5 inches. Using ultra-high-precision 3D-IC stacking technology, the readout LSI was made thinner to form TSVs for signal input/output, and on the opposite side, metal for bump connection was formed on a 100µm pitch connection pad to form silver-based bump material, and flip chip bonding was performed with CdTe that had also formed metal to form a 9.6mm square module was formed. This module was tiled on a substrate with extremely flat planarity. A tiling gap of 1 pixel and a physical distance of 40 µm between CdTe and CdTe were achieved. Signal and power lines are taken out and supplied by crossing 90°, and signals are output via a controller with FPGA and DPS. The DQE, MTF, and other characteristics of this CdTe-FPD will be discussed.
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