Mr. Kurt R. Kimmel Profile

Kurt R. Kimmel

Principal at HOYA Corp. USA

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Publications (22)

Proceedings Article | 27 May 2009 Paper

Mask salvage in the age of capital contraction

Kurt Kimmel

Proceedings Volume 7470, 747004 (2009) https://doi.org/10.1117/12.835795

KEYWORDS: Photomasks, Inspection, Semiconducting wafers, Error analysis, Optical lithography, Mask making, Scanners, Extreme ultraviolet, Etching, Critical dimension metrology

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Proceedings Article | 17 October 2008 Paper

Optimal mask characterization by Surrogate Wafer Print (SWaP) method

Kurt Kimmel, Ingo Hoellein, Jan Hendrick Peters, Paul Ackmann, Brid Connolly, Craig West

Proceedings Volume 7122, 712219 (2008) https://doi.org/10.1117/12.801685

KEYWORDS: Photomasks, Semiconducting wafers, Scanners, Inspection, Wafer inspection, Critical dimension metrology, Printing, Metrology, Manufacturing, Defect inspection

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Traditionally, definition of mask specifications is done completely by the mask user, while characterization of the mask relative to the specifications is done completely by the mask maker. As the challenges of low-k1 imaging continue to grow in scope of designs and in absolute complexity, the inevitable partnership between wafer lithographers and mask makers has strengthened as well. This is reflected in the jointly owned mask facilities and device manufacturers' continued maintenance of fully captive mask shops which foster the closer mask-litho relationships. However, while some device manufacturers have leveraged this to optimize mask specifications before the mask is built and, therefore, improve mask yield and cost, the opportunity for post-fabrication partnering on mask characterization is more apparent and compelling. The Advanced Mask Technology Center (AMTC) has been investigating the concept of assessing how a mask images, rather than the mask's physical attributes, as a technically superior and lower-cost method to characterize a mask. The idea of printing a mask under its intended imaging conditions, then characterizing the imaged wafer as a surrogate for traditional mask inspections and measurements represents the ultimate method to characterize a mask's performance, which is most meaningful to the user. Surrogate wafer print (SWaP) is already done as part of leading-edge wafer fab mask qualification to validate defect and dimensional performance. In the past, the prospect of executing this concept has generally been summarily discarded as technically untenable and logistically intractable. The AMTC published a paper at BACUS 2007 successfully demonstrating the performance of SWaP for the characterization of defects as an alternative to traditional mask inspection [1]. It showed that this concept is not only feasible, but, in some cases, desirable. This paper expands on last year's work at AMTC to assess the full implementation of SWaP as an enhancement to mask characterization quality including defectivity, dimensional control, pattern fidelity, and in-plane distortion. We present a thorough analysis of both the technical and logistical challenges coupled with an objective view of the advantages and disadvantages from both the technical and financial perspectives. The analysis and model used by the AMTC will serve to provoke other mask shops to prepare their own analyses then consider this new paradigm for mask characterization and qualification.

Proceedings Article | 26 March 2008 Paper

The use of EUV lithography to produce demonstration devices

Bruno LaFontaine, Yunfei Deng, Ryoung-Han Kim, Harry Levinson, Sarah McGowan, Uzodinma Okoroanyanwu, Rolf Seltmann, Cyrus Tabery, Anna Tchikoulaeva, Tom Wallow, Obert Wood, John Arnold, Don Canaperi, Matthew Colburn, Kurt Kimmel, Chiew-Seng Koay, Erin Mclellan, Dave Medeiros, Satyavolu Papa Rao, Karen Petrillo, Yunpeng Yin, Hiroyuki Mizuno, Sander Bouten, Michael Crouse, Andre van Dijk, Youri van Dommelen, Judy Galloway, Sang-In Han, Bart Kessels, Brian Lee, Sjoerd Lok, Brian Niekrewicz, Bill Pierson, Robert Routh, Emil Schmit-Weaver, Kevin Cummings, James Word

Proceedings Volume 6921, 69210P (2008) https://doi.org/10.1117/12.772933

KEYWORDS: Extreme ultraviolet lithography, Photomasks, Semiconducting wafers, Transistors, Extreme ultraviolet, Optical proximity correction, Photoresist processing, Etching, Metals, Scanners

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Proceedings Article | 15 March 2007 Paper

Initial experience establishing an EUV baseline lithography process for manufacturability assessment

O. Wood, D. Back, R. Brainard, G. Denbeaux, D. Goldfarb, F. Goodwin, J. Hartley, K. Kimmel, C. Koay, B. La Fontaine, J. Mackey, B. Martinick, W. Montgomery, P. Naulleau, U. Okoroanyanwu, K. Petrillo, B. Pierson, M. Tittnich, S. Trogisch, T. Wallow, Y. Wei

Proceedings Volume 6517, 65170U (2007) https://doi.org/10.1117/12.714016

KEYWORDS: Extreme ultraviolet lithography, Extreme ultraviolet, Reticles, Photomasks, Contamination, Reflectivity, Microscopes, Image resolution, Manufacturing, Lithography

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Proceedings Article | 4 May 2005 Paper

Progress toward developing high performance immersion compatible materials and processes

Karen Petrillo, Kaushal Patel, Rex Chen, Wenjie Li, Ranee Kwong, Peggy Lawson, Rao Varanasi, Chris Robinson, Steven Holmes, Dario Gil, Kurt Kimmel, Mark Slezak, Gary Dabbagh, Takashi Chiba, Tsutomu Shimokawa

Proceedings Volume 5753, (2005) https://doi.org/10.1117/12.601621

KEYWORDS: Polymers, Lithography, Immersion lithography, Materials processing, Semiconducting wafers, Particles, Photoresist materials, Image processing, Photoresist processing, Scanners

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Proceedings Article | 28 May 2004 Paper

Full field imaging with a 157-nm scanner

Chris Robinson, Nakgeuon Seong, Kurt Kimmel, Timothy Brunner, Michael Hibbs, Michael Lercel, Diane McCafferty, Harry Sewell, Timothy O'Neil, Juan Ivaldi, Keith Andresen

Proceedings Volume 5377, (2004) https://doi.org/10.1117/12.537447

KEYWORDS: Reticles, Critical dimension metrology, Photomasks, Binary data, Lithography, Scanners, Scanning electron microscopy, Phase shifts, Semiconducting wafers, Optical lithography

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Proceedings Article | 17 December 2003 Paper

Mask industry assessment: 2003

Kurt Kimmel

Proceedings Volume 5256, (2003) https://doi.org/10.1117/12.517438

KEYWORDS: Photomasks, Data processing, Binary data, Pellicles, Optical proximity correction, Microelectronics, Manufacturing, Printing, Yield improvement, Glasses

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Proceedings Article | 17 December 2003 Paper

Phase-enhanced DUV inspection of alternating phase-shift reticles

Larry Zurbrick, Maciej Rudzinski, Long He, Kurt Kimmel, Alvina Williams

Proceedings Volume 5256, (2003) https://doi.org/10.1117/12.518143

KEYWORDS: Inspection, Reticles, Defect detection, Manufacturing, Photomasks, Deep ultraviolet, Phase contrast, Quartz, Computer aided design, Phase shifts

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Proceedings Article | 28 May 2003 Paper

Inspection of alternating phase-shift masks through the use of phase contrast techniques

Larry Zurbrick, Maciej Rudzinski, Stanley Stokowski, Long He, Kurt Kimmel, Nishrin Kashwala

Proceedings Volume 5148, (2003) https://doi.org/10.1117/12.515102

KEYWORDS: Inspection, Quartz, Defect detection, Phase contrast, Photomasks, Etching, Lithography, Detection and tracking algorithms, Phase shift keying, Phase shifts

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Proceedings Article | 27 December 2002 Paper

Mask industry assessment: 2002

Kurt Kimmel

Proceedings Volume 4889, (2002) https://doi.org/10.1117/12.467389

KEYWORDS: Photomasks, Data processing, Binary data, Optical proximity correction, Microelectronics, Glasses, Pellicles, Yield improvement, Optical lithography, Databases

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Proceedings Article | 27 December 2002 Paper

Alternating phase-shift mask inspection through the use of phase contrast enhancement techniques

Larry Zurbrick, Maciej Rudzinski, Stanley Stokowski, Long He, Kurt Kimmel, Nishrin Kashwala

Proceedings Volume 4889, (2002) https://doi.org/10.1117/12.468086

KEYWORDS: Inspection, Quartz, Defect detection, Photomasks, Phase contrast, Lithography, Etching, Manufacturing, Binary data, Phase shifts

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Proceedings Article | 16 August 2002 Paper

Mask strategy at International SEMATECH

Kurt Kimmel

Proceedings Volume 4764, (2002) https://doi.org/10.1117/12.479332

KEYWORDS: Photomasks, Semiconducting wafers, Lithography, Semiconductors, Composites, Binary data, Pellicles, Inspection, Yield improvement, Manufacturing

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Proceedings Article | 11 March 2002 Paper

Financial impact of technology acceleration on semiconductor masks

Walter Trybula, Kurt Kimmel, Brian Grenon

Proceedings Volume 4562, (2002) https://doi.org/10.1117/12.458307

KEYWORDS: Manufacturing, Photomasks, Semiconductors, Inspection, Optical proximity correction, Pellicles, Tolerancing, Roads, Manufacturing equipment, Etching

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Proceedings Article | 11 March 2002 Paper

Alternating PSM defect printability at 193-nm wavelength

Chih-Cheng Lin, Young-Sik Kim, Kurt Kimmel

Proceedings Volume 4562, (2002) https://doi.org/10.1117/12.458277

KEYWORDS: Photomasks, Semiconducting wafers, Chromium, Critical dimension metrology, Phase measurement, Quartz, Printing, Computer simulations, Lithography, Phase shifts

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Proceedings Article | 14 September 2001 Paper

Novel Si-based composite thin films for 193/157-nm attenuated phase-shift mask (APSM) applications

S. Chey, Charles Guarnieri, Katherina Babich, Keith Pope, Dario Goldfarb, Marie Angelopoulos, Kenneth Racette, Michael Hibbs, Margaret Gibson, Kurt Kimmel

Proceedings Volume 4346, (2001) https://doi.org/10.1117/12.435779

KEYWORDS: Composites, Thin films, Photomasks, Phase shifts, Etching, Manufacturing, Dry etching, Oxygen, Transmittance, Metals

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Proceedings Article | 5 September 2001 Paper

New mask technology challenges

Kurt Kimmel

Proceedings Volume 4409, (2001) https://doi.org/10.1117/12.438408

KEYWORDS: Photomasks, Semiconducting wafers, Lithography, Semiconductors, Optical proximity correction, Binary data, Optical lithography, Manufacturing, Resolution enhancement technologies, Process modeling

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Proceedings Article | 30 December 1999 Paper

High-resolution ultraviolet defect inspection of DAP (darkfield alternate phase) reticles

Lars Liebmann, Scott Mansfield, Alfred Wong, Jacek Smolinski, Song Peng, Kurt Kimmel, Maciej Rudzinski, James Wiley, Larry Zurbrick

Proceedings Volume 3873, (1999) https://doi.org/10.1117/12.373310

KEYWORDS: Reticles, Inspection, Photomasks, Quartz, Defect inspection, Manufacturing, Binary data, Etching, Semiconducting wafers, Scanning electron microscopy

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Proceedings Article | 24 July 1996 Paper

Current status of x-ray mask manufacturing at the Microlithographic Mask Development Center

Kurt Kimmel, Patrick Hughes

Proceedings Volume 2793, (1996) https://doi.org/10.1117/12.245250

KEYWORDS: Photomasks, X-rays, Silicon carbide, Image processing, X-ray technology, Manufacturing, Standards development, X-ray lithography, Gold, Silicon

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Proceedings Article | 27 May 1996 Paper

X-ray mask fabrication advancements at the Microlithographic Mask Development Center

Kurt Kimmel, Patrick Hughes

Proceedings Volume 2723, (1996) https://doi.org/10.1117/12.240470

KEYWORDS: Photomasks, X-rays, Silicon carbide, Manufacturing, Mask making, Image processing, X-ray technology, Silicon, Gold, Inspection

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Proceedings Article | 27 May 1996 Paper

X-ray mask image-placement studies at the Microlithography Mask Development Center

Denise Puisto, Mark Lawliss, Thomas Faure, Janet Rocque, Kurt Kimmel, Douglas Benoit

Proceedings Volume 2723, (1996) https://doi.org/10.1117/12.240472

KEYWORDS: Photomasks, X-rays, Silicon, X-ray imaging, Plating, Image processing, Photoresist processing, Metrology, Electroplating, Silicon carbide

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Proceedings Article | 19 May 1995 Paper

Assessment of silicon carbide x-ray mask overlay performance in the IBM Advanced Lithography Facility x-ray stepper

Kurt Kimmel, Alek Chen, Lynn Powers, Ben Vampatella

Proceedings Volume 2437, (1995) https://doi.org/10.1117/12.209176

KEYWORDS: Silicon carbide, Optical alignment, Photomasks, Semiconducting wafers, X-ray lithography, X-rays, Silicon, Lithography, Oxides, Overlay metrology

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