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Luc Halipré
at imec
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Publications (1)
Proceedings Article | 5 October 2023 Paper
EUV mask defect inspection for the 3nm technology node
Yannick Hermans, Tilmann Heil, Renzo Capelli, Bartholomaeus Szafranek, Daniel Rhinow, Gerson Mette, Patrick Salg, Christian Felix Hermanns, Bappaditya Dey, Luc Halipre, Darko Trivkovic, Paulina Rincon Delgadillo, Thomas Marschner, Sandip Halder
Proceedings Volume 12802, 128020H (2023) https://doi.org/10.1117/12.2678392
KEYWORDS: Extrusion, Extreme ultraviolet, Semiconducting wafers, Critical dimension metrology, Scanning electron microscopy, Extreme ultraviolet lithography, Lithography, Defect inspection
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