Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I/O in InP PICs, even with waveguide spot size conversion. In a European research initiative – PHASTFlex - we develop and investigate an innovative, novel assembly concept, in which the waveguides in a matching TriPleX interposer PIC are released during fabrication to make them movable. After assembly of both chips by flip-chip bonding on a common carrier, TriPleX based actuators and clamping functions position and fix the flexible waveguides with the required accuracy.
In Europe a number of technology platforms for generic integration are being created for photonic integrated circuits (PICs); in Silicon, in passive dielectrics, and in Indium Phosphide. Such platforms are on the brink of commercialization, they offer a range of calibrated building blocks from which application specific PICs can be built and allow simplified, reduced cost access to a standardised technology, but presently only InP based platforms allow the integration of optical gain blocks; the essential feature of a semiconductor laser. The wavelength is constrained by the platform, usually C-band, but in the near future we expect other wavelengths in the 1.3μm-2.0μm range will be addressed. A frozen platform technology may not seem an ideal starting point for novel laser research but for what may be appear to be lost in epitaxial and process flexibility, much more is gained through a new-found ability to build up complex circuits quickly to deliver new and interesting laser based functionality. Building blocks such as reflectors (a distributed Bragg reflector (DBR) or a multimode interference reflector (MIR)), an amplifier section, and passive waveguides, can be built up by designers into integrated semiconductor lasers of a wide variety of types. This ready integration of novel sources with other circuit functionality can address a wide range of applications in telecoms, datacoms, and fibre based sensing systems. In this paper we describe a number of recent developments on generic InP-based platforms ranging from the fabrication of simple Fabry-Perot lasers, through tuneable DBR lasers, multi-wavelength comb lasers, picosecond pulse lasers and ring lasers.
Application Specific Photonic Integrated Circuits (ASPICs) are considered key elements to make photonic systems or subsystems cheap and ubiquitous. ASPICs still are several orders of magnitude more expensive than their microelectronic counterpart: ASICS, which has restricted their application to a few niche markets. A novel approach in photonic integration is emerging that will reduce the R&D costs of ASPICs by more than an order of magnitude. It will bring the application of ASPICs that integrate complex and advanced photonic functionality on a single chip within reach for a large number of small and larger companies and initiate a breakthrough in the application of Photonic ICs. In this paper the process is explained. A significant number of designs has been realized the last 4 years, for a variety of applications in telecoms, datacoms, medical and sensing, from parties all over the world.
In this paper we present recent results obtained in the area of monolithically integrated modelocked semiconductor laser systems using generic InP based integration platform technology operating around 1550nm. Standardized components defined in this technology platform can be used to design and realize short pulse lasers and optical pulse shapers. This makes that these devices can be realized on wafers that can contain many other devices. In the area of short pulse lasers we report design studies based on measured optical amplifier performance data. This work has the ultimate goal to establish a library of widely applicable short pulse laser designs. Such lasers can include components for e.g. wavelength control. An important boundary condition on the laser design is that the laser can be located anywhere on the InP chip. In the area of pulse shaping we report on a 20 channel monolithic pulse shaper capable of phase and amplitude control in each channel. Special attention is given to the calibration of the phase modulator and amplifier settings. Pulse compression and manipulation of pulse generated from modelocked semiconductor lasers is demonstrated using a 40 GHz quantum dash modelocked laser.
A key attribute emerging in the optoelectronic component supply industry is the ability to deliver 'solution level' products rather than discrete optical components to equipment manufacturers. This approach is primarily aimed at reducing cost for the equipment manufacturer both in engineering and assembly. Such 'solutions' must be designed to be cost effective - offering costs substantially below discrete components - and must be compatible with subcontract
board manufacture without the traditional and expensive skills of fibre handling, splicing and management.
Examples of 'solutions' in this context may be the core of a multifunctional OADM or a DWDM laser transmitter subsystem, with modulation, wavelength and power management all included in a simple to use module. Essential to the cost effective production of such solutions is a high degree of optical/optoelectronic integration. Co-packaging of discrete components and electronics into modules will not deliver the cost reduction demanded. At Bookham Technology we have brought together what we believe to be the three key integration technologies - InP for monolithic tunable sources, GaAs for high performance integrated modulation and ASOC for smart passives and hybrid platforms - which can deliver this cost reduction, together with performance enhancement, over a wide range of applications. In the paper we will demonstrate and compare our above integration approaches with the competing alternatives and seek to show how the power of integration is finally being harnessed in optoelectronics, delivering radical cost reduction as well as enabling system concepts virtually impossible to achieve with discrete components. In the paper we will demonstrate and compare our above integration approaches with the competing alternatives and seek to show how the power of integration is finally being harnessed in optoelectronics, delivering radical cost reduction as well as enabling system concepts virtually impossible to achieve with discrete components.
A fully automatic semiconductor-laser based Optical Phase Locked Loop (OPLL) subsystem has been developed using a packaged OPLL module and custom electronic circuits. The OPLL module contains a DFB laser and a multi-section tuneable laser operating at 1500 nm. The custom circuits perform the operations required to control the bias currents and temperatures of the lasers. When the subsystem is activated, the emission frequency of one of the lasers is slowly tuned to match the other laser emission frequency, thus beginning the locking process. A fibre coupler taps off a small part of the OPLL module output and detects the laser beat signal in an optical receiver. When this frequency matches that of the input LO signal to the OPLL module, the circuit detects the locked state and ensures that it is maintained. This paper details the design and implementation of the OPLL control and acquisition circuits, together with the performance of the OPLL subsystem.
This paper describes the design and performance of a 1:16 GaAs/A1GaAs photonics integrated circuit (PIC) for implementing the beamforming function in an optically controlled phased-array system. The PIC includes independent phase and amplitude control for all 16 channels and is flip-flop bonded onto a GaAs carrier which contains all the electrical track routing, thus leaving greater space on the PIC for electro-optic interaction and also avoiding crossovers between the optical waveguides and electrical tracks.
The ability to remotely radiate microwave signals has become an essential feature of modern electronic counter-measures (ECM) systems. The use of fiber optics allows remote microwave links to be constructed which have very low propagation loss and dispersion, are very flexible and light in weight, and have a high degree of immunity from external electromagnetic fields, crosstalk and environmental effects. This combination of desirable characteristics are very beneficial to avionic ECM antenna remoting as well as many other applications. GEC-Marconi have developed high performance fiber components for use in a towed radar decoy. The resulting rugged and compact optical transmitter and receiver modules have been developed and proven to maintain the required performance over the full hostile range of environmental conditions encountered on a fast jet. Packaged fiber optic links have been produced which can achieve a compression dynamic range of greater than 87 dB in 1 MHz bandwidth over a 2 to 18 GHz.
A packaged diode-laser OPLL sub-system has been constructed for evaluation in a proof-of-concept coherent optical beamforming system. The loop has been implemented with narrow linewidth laser diodes, micro-optics and wide bandwidth electronics to give optimum phase noise performance. The laser diodes are designed for wide bandwidth and high FM-efficiency, while the main challenge in the construction of the packaged OPLL is the realization of a high gain loop, with a small propagation delay. A total phase variance of 0.05 rad2 has been achieved, and that within the 15 MHz system bandwidth is 0.0007 rad2. The OPLL can operate with LO frequencies from 7-15 GHz. This paper details the performance of the completed OPLL module together with key results for the custom FM lasers designed and fabricated for use within it.
A coherent, optical heterodyne approach to signal generation and beamforming is particularly advantageous in multi-beam mobile phased arrays. Use of optical technology allows an optimum distribution of weight and power to be achieved between the antenna face and central electronics, together with an efficient implementation of the beamforming function and a modular design approach in which the basic building blocks are frequency-independent. Systems of this type employ a pair of optical carriers with a difference frequency equal to the required microwave signal. Phased- locking is necessary in order to achieve sufficiently low phase noise in the radio communication link. Optical phase locked loops (OPLLs) have been shown to be potential candidates for this application, yet work still needs to be done to bring them from the laboratory to field demonstrations. This paper describes the construction of a laser-diode OPLL subsystem for evaluation in a proof-of- concept beamforming system. This involves optimization of the loop design, development of single-frequency laser diodes with the correct linewidth, modulation and tuning characteristics and integration into a micro-optic assembly with custom wideband electronics.
Optoelectronic techniques offer major benefits in the construction of space-borne phased arrays with stringent performance requirements, not only in signal distribution functions but also in the beam forming processing itself. In the course of a current project for European Space Agency we have designed the constructed proof of concept hardware to demonstrate the use of coherent optical techniques in the formation of antenna beams. The scenario at the basis of our study is for a telecommunication satellite with a 160-element phased array antenna, forming 15 beams, each of which can carry up to 20 QPSK modulated carriers, with up to 6 operating simultaneously. Operation is in the 12/14 GHz bands for downlink and uplink operation respectively. In our beamforming concept we have employed an optical heterodyne approach in which the phase shift and amplitude required for beamforming is imposed upon an optical carrier, the RF waveform required for transmission being derived subsequently by mixing with an optical local oscillator signal. Phase encoding for data modulation is also carried out in the optical domain.
The effective exploitation of fibre optics throughout the telecommunications network will demand components which can perform signal routing and control functions in the optical domain under electronic control. In many applications the optical switching elements themselves must be accompanied by high speed electronics and by monitoring photoreceivers to provide for feedback control and self-routing of signals. Cost and reliability considerations point strongly towards the monolithic integration of these functions in an appropriate optoelectronic integrated circuit technology. In this paper we discuss recent progress in our laboratory towards the integration of the three functions discussed above. Experimental data are presented on the performance of optical switching devices, detectors and heterojunction bipolar transistors (HBT's) designed specifically for monolithic integration in the InP/InGaAsP material system.
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