Min-Woo Kim
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 21 November 2023 Poster + Paper
Proceedings Volume 12750, 1275016 (2023) https://doi.org/10.1117/12.2686285
KEYWORDS: Thermal deformation, Semiconducting wafers, Extreme ultraviolet lithography, Materials properties, Scanners, Optical lithography, Finite element methods, Extreme ultraviolet, Convection, Overlay metrology

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