As processes become more complex, and more operations are needed to fabricate individual levels in a sem iconductor chip, the ability to leverage the wealth of information to fully monitor and control the process has become of critica l importance. In this work we extend the application of design-aware fabrication process models to more operations. While one could expect that the process models become more accurate with respect to the target of interest, one of the main benefits of applying this technique is that it further decouples the individual influences that every process step imposes to different designs at different stages of the fabrication process. These results have significant implications on how this methodology can be used to improve process monitoring, a nd in the future extend to process optimization and design specific process control.
KEYWORDS: Metrology, Bridges, Manufacturing, Data modeling, Time metrology, Semiconducting wafers, Reticles, Internet, Design for manufacturability, Data integration
In the world of today’s internet of things economy, the number of semiconductor designs is increasing rapidly. A cost effective way is needed to set up new designs for manufacturing. All available data sources need to be utilized to do the setup. In this paper we suggest two new approaches for reusing historical data for future designs: Combining historical fab-generated data with full reticle design features to predict optimal process conditions, and the concept of cross metrology integration of fab-generated data across multiple metrology steps to improve data quality.
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