A multi-beam type laser metal deposition (LMD) system equipped with two blue diode lasers (B-LMD) was developed to form a three-dimensional object production of a pure copper rod. Beams output from the two blue diode lasers are combined at the focal point, and pure copper powder is supplied there, the processing head is moved in the vertical direction to continuously melt and solidify the pure copper. A 100 mm long pure copper rod was formed in 25 seconds with multibeam LMD system using two 100 W-class blue diode lasers. The long side of the formed pure copper rod was 780 μm and the short side was 600 μm, which was larger than the spot at the focal point. Observation with a high-speed video camera showed that the pure copper rod was formed with a thin molten layer at a position 300 µm away from the focal point ( Z = 300 μm). When the laser profile at Z = 300 μm and the cross section of the pure copper rod were overlapped, the size of the pure copper rod coincided with the laser irradiation.
In order to clarify the influence of light absorption characteristics and thermal conductivity of the substrate in forming a pure copper layer using multi-laser cladding system, a pure copper layer was formed on two type substrates. Two lasers were combined at a focal point to set a spot diameter of 507 μm. At the same time, pure copper powder having an average particle size of 34 μm was supplied from a center nozzle. The powder melted and solidified to form a pure copper layer on the substrate surface. The copper coated samples were cut with a micro-cutter, and cross section was observed with the microscope to investigate layer thickness, penetration depth and material organization. As a result, it was confirmed that the copper layer became larger as the laser input energy increased. And compared with the substrates of stainless steel and copper alloy, it was found that the input energy of copper alloy substrate required about 3 times more energy than that of stainless steel substrate. Therefore, it was revealed that the laser input energy depended on the thermal conductivity of the substrate.
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