The purpose of this work is to demonstrate that a novel fabrication method for 3-D microstructures (FORMULA) is applicable to fabrication of micro mechanical parts with a large flexibility. This method is a kind of layer manufacturing method of thin films for metallic or dielectric microstructures using surface-activated bonding (SAB). The bonding interfaces of thin films are investigated by transmission electron microscope (TEM). Voids were observed at the interfaces of both pure aluminum films and Al-Cu alloy films. The ratio of void on the Al-Cu/Al-Cu interface is much larger than that of Al/Al interface, although the films have the same surface roughness of 3nm in Ra (average roughness). And approximately 10nm-thick amorphous intermediate layers were found at the interfaces. Furthermore, we have fabricated a micro gear of 900μm in diameter and 200μm in height, which is about ten times as large as our previous test pieces. Overhung structures such as a bridge structure and a cantilever were also fabricated without supporting layers beneath them.
Conventional electrical bus system technologies are encountered their physical borders in terms of transmission length and parasitic capacity of lines, and thus, many optical interconnection technologies are proposed to solve the problems in the electrical circuits. In this paper, we propose a new optical bus with sheet like shape technology using diffusion controlled light transmission in the multi- planar waveguides that makes capability of broadcasting, simultaneous bidirectional transmission, easy alignment and plural multiplex transmission. We have fabricated a basic model using optical sheet bus technology for the first time and evaluate them at 500MHz clock operation as follows: (1) synchronous broadcasting transmission to control transmission delay; (2) simultaneous bidirectional transmission in the same waveguide; (3) multiplex transmission such as time division multiplexing, wavelength division multiplexing and so on. Through this fabrication and evaluation, we can pick up some approach to put the optical sheet bus technology into practice with feature as follows: (a) simple design rule for multi-accessible bus systems like as shared memory bus systems, which needs faster speed; (b) added-value of multiplex transmission ways that reduce circuit frequency, minimize power consumption, maximize transmission bandwidth, and bring about no-wait communications for the bus systems.
An A4 page width and 300 dot/inch hydrogenated amorphous silicon thin film transistor (a- Si:H TFT) driven contact image sensor which can read more than 128 gray levels has been developed. Crosstalk due to the coupling between data lines in the multiplex circuit has prevented high gray scale reading. In order to eliminate crosstalk, a sensor with a new multiplex structure has been developed with a ground mesh shield layer inserted at the crossover points between each data line. The ground mesh shield pattern was designed to optimize the gray scale reproduction ratio R. With this sensor, R is more than 0.992 for a single bit, thus achieving 128 levels of gray. This design was compared to the performance of two other sensors, one without a ground mesh shield, the other using a data line meander pattern. This technology is also applicable to higher performance image sensors with greater than 400 dot/inch resolution.
A high performance page width linear image sensor with a new multiplex structure called 'meander lines' has been developed. The sensor has an A3 page width (310 mm) with resolution of 400 dot per inch (DPI) and is operated at 4 MHz. The meander lines have been adopted to eliminate the crosstalk coupling and also to get small line capacitance closely related to high photoresponsivity. The sensor achieved a photoresponsivity of 20 V/lx(DOT)s and more than 64 gray scale reading capability. A compact image scanning unit was made of size 420 mm (W) X 130 mm (L) X 30 mm (H). It was tested and the reproduced image was good quality.
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