CONFERENCE PROCEEDINGS
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Takashi Tsuto
at Nikon Corp
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Publications (3)
SPIE Journal Paper | 29 January 2014
Macroinspection methodology for through silicon via array in three-dimensional integrated circuit
Yoshihiko Fujimori, Takashi Tsuto, Kazuya Okamoto, Kyoichi Suwa, Hiroyuki Tsukamoto
JM3, Vol. 13, Issue 01, 011204, (January 2014) https://doi.org/10.1117/12.10.1117/1.JMM.13.1.011204
KEYWORDS: Diffraction, Semiconducting wafers, Inspection, Silicon, Polarization, Wafer-level optics, Integrated circuits, Signal detection, Wafer testing, Polarizers
SPIE Journal Paper | 11 February 2013 Open Access
New methodology for through silicon via array macroinspection
Yoshihiko Fujimori, Takashi Tsuto, Yuji Kudo, Takeshi Inoue, Kyoichi Suwa, Kazuya Okamoto
JM3, Vol. 12, Issue 01, 013013, (February 2013) https://doi.org/10.1117/12.10.1117/1.JMM.12.1.013013
KEYWORDS: Semiconducting wafers, Diffraction, Inspection, Silicon, Etching, Wafer-level optics, Wafer testing, Scanning electron microscopy, Near infrared, Signal processing
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Proceedings Article | 20 April 2011 Paper
A new methodology for TSV array inspection
Yoshihiko Fujimori, Takashi Tsuto, Yuji Kudo, Takeshi Inoue, Kazuya Okamoto
Proceedings Volume 7971, 79710I (2011) https://doi.org/10.1117/12.879379
KEYWORDS: Diffraction, Semiconducting wafers, Inspection, Etching, Silicon, Wafer testing, Near infrared, Wafer-level optics, Signal processing, Image sensors
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