The mechanical properties of two aluminium thin films manufactured by two different laboratories were investigated
using in-plane uniaxial tensile stress. The geometrical parameters, in particular film thickness, were accurately measured
and their influences on the mechanical properties were analyzed. The specimens provided by each supplier show
significant differences of their mechanical properties. In the same way, annealing was performed on a specific set of
specimens and its influence on the mechanical properties is highlighted and discussed.
Comparisons between several pairs of contact materials are done with a new methodology using a commercial nanoindenter coupled with electrical measurements on test vehicles specially designed to investigate microscale contact physics. Experimental measurements are obtained to characterize the response of a 5-µm2-square contact bump under electromechanical stress with increased applied current. The data provide a better understanding of microcontact behavior related to the impact of current at low- to medium-power levels. Contact temperature rise is observed, leading to shifts of the mechanical properties of contact materials and modifications of the contact surface. The stability of the contact resistance, when the contact force increases, is studied for contact pairs of soft (Au/Au contact), harder (Ru/Ru contact), and mixed material configuration (Au/Ru contact). An enhanced stability of the bimetallic contact Au/Ru is demonstrated, considering sensitivity to power increase related to creep effects and topological modifications of the contact surfaces. These results are compared to previous ones and discussed in a theoretical way by considering the temperature distribution around the hottest area at the contact interface.
Comparisons between several pairs of contact materials have been done with a new methodology using a commercial
nanoindenter coupled with electrical measurements on test vehicles specially designed to investigate the micro-scale
contact physics. Experimental measurements are obtained to characterize the response of a 5 μm2 square contact bump
under electromechanical stress with increased applied current. The data provide a better understanding of micro-contact
behaviour related to the impact of current at low- to medium-power levels. Contact temperature rise is observed, leading
to shifts of the mechanical properties of contact materials and modifications of the contact surface. The stability of the
contact resistance, when the contact force increases, is studied for contact pairs of soft (Au/Au contact), harder (Ru/Ru
contact) and mixed material configuration (Au/Ru contact). An enhanced stability of the bimetallic contact Au/Ru is
demonstrated considering sensitivity to power increase, related to creep effects and topological modifications of the
contact surfaces. These results are compared to previous ones and discussed in a theoretical way by considering the
temperature distribution around the hottest area at the contact interface.
Until now, the determination of the hermeticity of microelectronic packages is related to the MIL-STD-883 method 1014
which is based on the He leak detection method. But this method is no more suited for small packages due to the
resolution limit of the apparatus used conventionally. Indeed the minimum detectable leak rate is of the order of 5.10-11
atm.cm3.s-1. Leaks induced by non hermetic MEMS packages are often one order of magnitude smaller. So, the
sensitivity of the He leak detector method is too low and this method can not be applied anymore. The MEMS packages
produced with wafer level encapsulation techniques, require new methodologies to measure hermeticity appropriately
and accurately. The purpose of this paper is to present the development of alternative methods for testing the hermeticity
of MEMS micro-cavities. Two methods will be investigated in the context of this study: The membrane deflection
measurement exposed to different pressures, using optical profilometry, and the measurement of the variation of gas
concentration in a sealed silicon cavity by Fourier-transform infrared spectroscopy (FT-IR). The calculated leak rates are
compared for samples where standard fine leak test gave no results. The values obtained for the leak rates within optical
test and FT-IR test for the same sample are identical, showing the relevance of these two methods.
KEYWORDS: Microelectromechanical systems, Reliability, Commercial off the shelf technology, Finite element methods, 3D modeling, Physics, Failure analysis, Profilometers, Capacitance, Material characterization
COTS (Commercial-off-the-shelf) MEMS components are very interesting for space applications because they are lightweight, small, economic in energy, cheap and available in short delays. The reliability of MEMS COTS that are used out of their intended domain of operation (such as a space application) might be assured by a reliability methodology derived from the Physics of Failure approach. In order to use this approach it is necessary to create models of MEMS components that take into consideration environmental stresses and thus can be used for lifetime prediction. Unfortunately, today MEMS failure mechanisms are not well understood today and therefore a preliminary work is necessary to determine influent factors and physical phenomena. The model development is based on a good knowledge of the process parameters (Young’s modulus, stress...), environmental tests and appropriated modeling approaches, such a finite element analysis (FEA) and behavioural modeling. In order to do the environmental tests and to analyse MEMS behaviour, we have developed the Environmental MEMS Analyzer EMA 3D. The described methodology has been applied to a Commercial-off-the-shelf (COTS) accelerometer, the ADXL150. A first level behavioral model was created and then refined in the following steps by the enrichment with experimental results and finite element simulations.
RF switches are believed to replace PIN diodes and MESFETs in numerous future RF applications. But most of the actual applications require high reliability and long lifetimes for their devices. As MEMS is a new technology, aging tests and qualification procedures have yet to be demonstrated. MEMSCAP and CNES are developing an environmental test bench for the study of RF switch failure modes. This paper focuses, in particular, on the influence of the temperature in metallic RF switches/ Actually, architectures, such as the metallic air bridge, the membrane switch and the dielectric switch, display good RF performances. We will show in this paper that most of today's switches are sensitive to buckling. In particular, a few tens of degrees Celsius are enough to create a deformation that drives the air bridge switch (in ON or OFF position) to fatal failure. The influence of tensile pre-stress is also studied since it increases the buckling critical temperature. However, the required pre-stress range will degrade significantly the actuation voltage. Finally, stress relaxation structures are believed to decrease the sensitivity to high temperature while keeping a reasonable actuation voltage.
This paper describes the reliability approach performs at CNES to evaluate MEMS for space application. After an introduction and a detailed state of the art on the space requirements and on the use of MEMS for space, different approaches for taking into account MEMS in the qualification phases are presented. CNES proposes improvement to theses approaches in term of failure mechanisms identification. Our approach is based on a design and test phase deeply linked with a technology study. This workflow is illustrated with an example: the case of a variable capacitance processed with MUMPS process is presented.
This paper presents the work we have done on micro-relays with gold micro-contacts in MUMPs. Firstly, the theoretical physical principles of MEMS micro-relay are described. This study is divided in two parts: the micro-contact and the micro-actuator. The micro-contact part deals with resistance of constriction, contact area, adhesion, arcing and wear. Whereas the micro-actuator part describes general principles, contact force, restoring force and actuator reliability. Then, in a second part, an innovative electrostatic relay design in MUMPs is presented. The concept, the implementation and the final realization are discussed. Then, in the third part, characterization results are reported. This part particularly focuses on the micro-contact study. Conduction mode, contact area, mechanical and thermal deformation, and adhesion energies are presented.
This paper demonstrates that RF MEMS micro-switches can be realized with a low cost MEMS technology such as MUMPs. Two different switches are proposed, namely the hinged beam switch and the gold overflowing switch. Their concepts, design and characterization are described in details. On-resistance as low as 5 - 6 (Omega) for the gold overflowing switch and 2 - 3 (Omega) for the hinged beam switch have been measured. Finally, experimental measurements showed that force and electrical current had strong influences on the overall electrical contact.
This paper presents the work performed in MUMPs on RF MEMS micro-switch. Concepts, design and characterization of switches are studied. The study particularly focuses on the electrical resistance characterization and modelization. The switches developed uses two different principle: overflowed gold and hinged beam. The realized contacts exhibited high on resistance (~20(Omega) ) due to nanoscopics asperities of contacts and insulating interfacial films. Results of a typical contact cleaning method are also presented.
The emerging MicroElectroMechanical Systems (MEMS) technologies are entering in an active phase of high volume production and successful commercial applications. The expertise and the qualification for space application of such devices have already begun. But these technologies are still recent and important efforts on the reliability issue have to be done. This paper defines the role oftechnological analysis in the actual MEMS design process. Afterwards, it presents MEMS technological analysis techniques developed at CNES applied to an open MEMS technology. In particular, it is shown how these technological analyses respond to designer needs and that the designer and the founder still need a strong interaction. We also present the MEMS reliability issue at CNES and replace it in the current world's one.
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