Photoelectric properties of transparent conductive metal mesh films based on crack template and its application in Perovskite solar cells

Zonghu Xiao; Wei Zhong; Hui Ou; Haiyan Fu; Shunjian Xu; Yongping Luo

doi:10.1117/12.2540113

8 July 2019 Photoelectric properties of transparent conductive metal mesh films based on crack template and its application in Perovskite solar cells

Zonghu Xiao, Wei Zhong, Hui Ou, Haiyan Fu, Shunjian Xu, Yongping Luo

Author Affiliations +

Proceedings Volume 11064, Tenth International Conference on Thin Film Physics and Applications (TFPA 2019); 110640Z (2019) https://doi.org/10.1117/12.2540113
Event: Pacific Rim Laser Damage 2019 and Thin Film Physics and Applications 2019, 2019, Qingdao, China

Abstract

A transparent conductive metal mesh film (TCMMF) was successfully fabricated by a low-cost and simple process. Firstly, the crack mask pattern is obtained after a certain heat treatment process, based on a glass substrate coated with egg-white. Then, a TCMMF was fabricated in combination with a series of processes such as metal deposition and mask removal. In this paper, the film formation mechanism and performance of the TCMMF based on random crack templates are studied, and the TCMMF have also been used in perovskite solar cells (PSCs).The results showed that the TCMMF’s transmittance is more than 90% in the UV-visible range and infrared-visible range. The TCMMF’s surface resistance measured by the four probe method is 20 Ω/□. The performance of the PSCs based on the TCMMF can be comparable to that of the PSCs based on ITO, with a photoelectric conversion efficiency of 13.8%. This provides a possibility for the application of TCMMF in photovoltaic and photovoltaic fields.

Citation Download Citation

Zonghu Xiao, Wei Zhong, Hui Ou, Haiyan Fu, Shunjian Xu, and Yongping Luo "Photoelectric properties of transparent conductive metal mesh films based on crack template and its application in Perovskite solar cells", Proc. SPIE 11064, Tenth International Conference on Thin Film Physics and Applications (TFPA 2019), 110640Z (8 July 2019); https://doi.org/10.1117/12.2540113

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