Challenges and opportunities in material development and understanding that enables advanced photolithography

Mingqi Li; Emad Aqad; Tomas Marangoni; James F. Cameron; Paul LaBeaume; Jung-June Lee; Jae-Hwan Sim; Choong Bong Lee; Xisen Hou; Michael J. Eller; Stanislav V. Verkhorurov; Emile A. Schweikert; Peter Trefonas; Chengbai Xu

doi:10.1117/12.2657445

30 April 2023 Challenges and opportunities in material development and understanding that enables advanced photolithography

Mingqi Li, Emad Aqad, Tomas Marangoni, James F. Cameron, Paul LaBeaume, Jung-June Lee, Jae-Hwan Sim, Choong Bong Lee, Xisen Hou, Michael J. Eller, Stanislav V. Verkhorurov, Emile A. Schweikert, Peter Trefonas, Chengbai Xu

Author Affiliations +

Proceedings Volume 12498, Advances in Patterning Materials and Processes XL; 124980H (2023) https://doi.org/10.1117/12.2657445
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

Semiconducting device manufacture encounters more lithographic challenges in terms of feature size shrinking, killer contaminants, and balancing performance requirements for advanced node patterning. This talk will provide an overview of the key barriers and scopes for materials innovations to enable high resolution patterning, fast photospeed, low roughness and defects, while maintaining a good processing window. It will also provide a fundamental view of how nanometric uniformity and the interplay between different components in a photoresist thin film impact pattern fidelity.

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Citation Download Citation

Mingqi Li, Emad Aqad, Tomas Marangoni, James F. Cameron, Paul LaBeaume, Jung-June Lee, Jae-Hwan Sim, Choong Bong Lee, Xisen Hou, Michael J. Eller, Stanislav V. Verkhorurov, Emile A. Schweikert, Peter Trefonas, and Chengbai Xu "Challenges and opportunities in material development and understanding that enables advanced photolithography", Proc. SPIE 12498, Advances in Patterning Materials and Processes XL, 124980H (30 April 2023); https://doi.org/10.1117/12.2657445

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