Paper
15 August 2023 Research progress of liquid cooling technology for high heat flux electronic equipment
Zhehua Du
Author Affiliations +
Proceedings Volume 12719, Second International Conference on Electronic Information Technology (EIT 2023); 1271908 (2023) https://doi.org/10.1117/12.2685556
Event: Second International Conference on Electronic Information Technology (EIT 2023), 2023, Wuhan, China
Abstract
Heat flux of electronic equipment shows an increasing trend with the increasing demand for miniaturization and high performance. Low heat dissipation capacity makes it difficult to apply air cooling technology to high heat flux electronic devices in the future. At present, liquid cooling technology is the research hotspot of cooling solutions for electronics, mainly because liquid cooling has the advantages of strong fluidity and high heat transfer coefficient. Several kinds of liquid cooling technologies which can be used for cooling electronic equipment are introduced in this paper, among which micro-channel cooling, spray cooling, jet cooling and immersion cooling are emphasized. The working principle and progress in research of each liquid cooling technology are introduced and analyzed. Finally, the future development direction of liquid-based cooling technology is discussed. The problems in the research direction of liquid cooling technology are pointed out. Some suggestions for further research on liquid cooling technology are put forward.
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zhehua Du "Research progress of liquid cooling technology for high heat flux electronic equipment", Proc. SPIE 12719, Second International Conference on Electronic Information Technology (EIT 2023), 1271908 (15 August 2023); https://doi.org/10.1117/12.2685556
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KEYWORDS
Heat flux

Electronic components

Microfluidics

Thermal effects

Biomimetics

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