Wim de Boeij,1 Bart Smeets,1 Massimo Viola,1 Peter van Gils,1 Elliot Oti,1 Stefan Lichiardopol,1 Jelmer Kamminga,1 Mohamed El Kodadi,1 Aditya Deshpande,1 Alberto Pirati1
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In this paper we will report on the most recent immersion scanner innovations to improve scanner matching overlay. These are realized by improvements in e.g. optical column distortion, wafer alignment and system-metrology. We will elaborate on scanner solutions for wafer handling/chucking of warped wafers. Furthermore, to enable cost-of-ownership reduction, system design implementations driving larger scanner productivity (wafer per hour) will be presented.
Conference Presentation
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
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Wim de Boeij, Bart Smeets, Massimo Viola, Peter van Gils, Elliot Oti, Stefan Lichiardopol, Jelmer Kamminga, Mohamed El Kodadi, Aditya Deshpande, Alberto Pirati, "Driving exposure accuracy and cost-of-ownership on DUV immersion and dry-NXT scanner products," Proc. SPIE 12953, Optical and EUV Nanolithography XXXVII, 129530S (10 April 2024); https://doi.org/10.1117/12.3009961