Paper
1 March 1991 Progress of an advanced diffusion source plasma reactor
Neil M. P. Benjamin, Brian N. Chapman, Rod W. Boswell
Author Affiliations +
Proceedings Volume 1392, Advanced Techniques for Integrated Circuit Processing; (1991) https://doi.org/10.1117/12.48906
Event: Processing Integration, 1990, Santa Clara, CA, United States
Abstract
While the main thrust for downstream reactors has so far focussed on electron cyclotron resonance (ECR) sources operating at 2. 45MHz there are potential price versus performance advantages to be obtained from working in the more conventional 13. 56 MHz frequency regime with novel antenna structures. Desirable features such as high rate uniform etching with low bias capability are retained while others such as reactant use and field efficiency are improved. Progress towards a practical realization of such a reactor will be reported and results obtained in a test stand operation will be presented for a variety of materials and conditions.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Neil M. P. Benjamin, Brian N. Chapman, and Rod W. Boswell "Progress of an advanced diffusion source plasma reactor", Proc. SPIE 1392, Advanced Techniques for Integrated Circuit Processing, (1 March 1991); https://doi.org/10.1117/12.48906
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Cited by 4 scholarly publications.
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KEYWORDS
Plasma

Semiconducting wafers

Diffusion

Etching

Magnetism

Ions

Integrated circuits

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