Paper
1 December 1991 Technique of assessing contact ohmicity and their relevance to heterostructure devices
H. Barry Harrison, Geoffrey K. Reeves
Author Affiliations +
Proceedings Volume 1596, Metallization: Performance and Reliability Issues for VLSI and ULSI; (1991) https://doi.org/10.1117/12.51011
Event: Microelectronic Processing Integration, 1991, San Jose, CA, United States
Abstract
This paper briefly reviews techniques to assess and model ohmic contacts between layers with finite conductivity. It is then extended to consider aspects of these models that are applicable to multilayer structures such as those found in high electron mobility transistors [HEMTS] and provides electrical models for these structures. Experimental results are included in some instances to provide insight into the magnitude of the parameters of the models.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
H. Barry Harrison and Geoffrey K. Reeves "Technique of assessing contact ohmicity and their relevance to heterostructure devices", Proc. SPIE 1596, Metallization: Performance and Reliability Issues for VLSI and ULSI, (1 December 1991); https://doi.org/10.1117/12.51011
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Resistance

Field effect transistors

Gallium arsenide

Reliability

Silicon

Very large scale integration

Heterojunctions

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