Laser micromachined and laminated microchannel components for chemical sensors and heat transfer applications

Peter M. Martin; Wendy D. Bennett; D. J. Hammerstrom; John W. Johnston; Dean W. Matson

doi:10.1117/12.284536

5 September 1997 Laser micromachined and laminated microchannel components for chemical sensors and heat transfer applications

Peter M. Martin, Wendy D. Bennett, D. J. Hammerstrom, John W. Johnston, Dean W. Matson

Author Affiliations +

Proceedings Volume 3224, Micromachined Devices and Components III; (1997) https://doi.org/10.1117/12.284536
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States

Abstract

The fabrication of microchannel chemical sensors with seven laminated individual functional modules is described. The sensors, used to detect chromium in nuclear and chemical waste streams, were fabricated using laser micromachining, bulk silicon micromachining, photolithographic techniques, sputter coating deposition, and anodic and adhesive bonding processes. The size of the sensor was 2 cm by 2.2 cm, with a total thickness of 2.2 cm. It consisted of two or more reservoir modules to hold the liquids being evaluate, two or more micropump modules to pump the liquids through the sensor, a chemical mixing module, a reaction module, and a sensor module with electrical circuitry for connection to external measurement equipment. The fluids were directed through the layers by interconnecting flow channels. The reservoir modules were fabricated by machining Pyrex and anodic bonding to silicon. The chemical mixing module was fabricated by wet etching Pyrex and anodic bonding to silicon. The reaction module contained a serpentine 200- micrometers -wide channel, and was formed by laser micromachining polyimide. The first prototype of this sensor employed external micropumps, while the second prototype will use off-the-shelf piezoelectric micropumps. The detector layer consisted of iridium, silver, and platinum sensor pads connected to gold contact strips. The modules were joined using adhesive bonding, and an electrostatic technique was used for silicon-Pyrex bonding.

Citation Download Citation

Peter M. Martin, Wendy D. Bennett, D. J. Hammerstrom, John W. Johnston, and Dean W. Matson "Laser micromachined and laminated microchannel components for chemical sensors and heat transfer applications", Proc. SPIE 3224, Micromachined Devices and Components III, (5 September 1997); https://doi.org/10.1117/12.284536

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