Laser chemical process for clean applications of semiconductor manufacturing

David Yogev; Michael Y. Engel; Shaike Zeid; Izhack Barzilay; Boris Livshits

doi:10.1117/12.387543

7 June 2000 Laser chemical process for clean applications of semiconductor manufacturing

David Yogev, Michael Y. Engel, Shaike Zeid, Izhack Barzilay, Boris Livshits

Proceedings Volume 3933, Laser Applications in Microelectronic and Optoelectronic Manufacturing V; (2000) https://doi.org/10.1117/12.387543
Event: Symposium on High-Power Lasers and Applications, 2000, San Jose, CA, United States

Abstract

Cleaning applications in the semiconductor manufacturing industry are tougher to meet as the device dimensions decrease. The uniqueness of Oramir-Laser-Chemical process relies on the mutual combination and effectiveness of laser particle removal mechanisms and laser induced photon- thermal-chemical reaction in the mixture of O₂/O₃/NF₃ gases. The process involves ozone blast wave, photodecomposition of O₃ into O radicals, photo-thermal decomposition of NF₃ into fluorine radicals, thermal effects and thin liquid-chemical ablation enhanced particle removal. Recent results on Bare Si wafers, photomasks, EUV masks and scalpel masks show substantial removal efficiency, up to 100 percent for certain applications.

Citation Download Citation

David Yogev, Michael Y. Engel, Shaike Zeid, Izhack Barzilay, and Boris Livshits "Laser chemical process for clean applications of semiconductor manufacturing", Proc. SPIE 3933, Laser Applications in Microelectronic and Optoelectronic Manufacturing V, (7 June 2000); https://doi.org/10.1117/12.387543

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