In-situ film thickness measurement for CVD by use of spectrometer

Tomomi Ino; Akira Soga; Yoshiaki Akama; Naoto Nishida

doi:10.1117/12.406375

15 December 2000 In-situ film thickness measurement for CVD by use of spectrometer

Tomomi Ino, Akira Soga, Yoshiaki Akama, Naoto Nishida

Proceedings Volume 4087, Applications of Photonic Technology 4; (2000) https://doi.org/10.1117/12.406375
Event: 2000 International Conference on Application of Photonic Technology (ICAPT 2000), 2000, Quebec City, Canada

Abstract

A new in situ measurement system of film thickness for thermal CVD based on thin film interference is presented. Comparing the radiation spectrum during deposition with that before deposition, we controlled the thickness of' the films with accuracy of 3nm on the thermal process where the temperature changes significantly. Using the interfi.rence of the substrate, we measured thickness of the film thinner than 2Onm.

Citation Download Citation

Tomomi Ino, Akira Soga, Yoshiaki Akama, and Naoto Nishida "In-situ film thickness measurement for CVD by use of spectrometer", Proc. SPIE 4087, Applications of Photonic Technology 4, (15 December 2000); https://doi.org/10.1117/12.406375

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available