Vapor deposited release layers for nanoimprint lithography

Tong Zhang; Boris Kobrin; Mike Wanebo; Romek Nowak; Richard Yi; Jeff Chinn; Markus Bender; Andreas Fuchs; Martin Otto

doi:10.1117/12.654658

23 March 2006 Vapor deposited release layers for nanoimprint lithography

Tong Zhang, Boris Kobrin, Mike Wanebo, Romek Nowak, Richard Yi, Jeff Chinn, Markus Bender, Andreas Fuchs, Martin Otto

Proceedings Volume 6151, Emerging Lithographic Technologies X; 615117 (2006) https://doi.org/10.1117/12.654658
Event: SPIE 31st International Symposium on Advanced Lithography, 2006, San Jose, California, United States

Abstract

This paper presents the advantages of using a vapor deposited self-assembled monolayer (SAM) as a mold release layer for nano-imprint lithography. The release SAM was formed from a perfluorinated organo-silane precursor at room temperature in the gaseous state by a technique called Molecular Vapor Deposition (MVD^TM). In contrast to a conventional coating from a liquid immersion sequence, the vapor deposition process forms a particulate free film resulting in a substantial reduction of surface defects. Another advantage of the vapor process is its excellent conformity onto the nanoscale topography of the mold. The self-assembling and self-limiting characteristics of the MVD process enables excellent CD control of the mold pattern. Pattern replication as small as 38nm features was achieved. Various other quantitative metrics of the MVD release layer are presented in this paper.

Citation Download Citation

Tong Zhang, Boris Kobrin, Mike Wanebo, Romek Nowak, Richard Yi, Jeff Chinn, Markus Bender, Andreas Fuchs, and Martin Otto "Vapor deposited release layers for nanoimprint lithography", Proc. SPIE 6151, Emerging Lithographic Technologies X, 615117 (23 March 2006); https://doi.org/10.1117/12.654658

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