A comparison of alignment and overlay performance with varying hardmask materials

Sangho Yun; Soon Mok Ha; Young Min Nam; Cheol-Hong Kim; Suk-Woo Nam

doi:10.1117/12.917412

4 April 2012 A comparison of alignment and overlay performance with varying hardmask materials

Sangho Yun, Soon Mok Ha, Young Min Nam, Cheol-Hong Kim, Suk-Woo Nam

Proceedings Volume 8324, Metrology, Inspection, and Process Control for Microlithography XXVI; 832407 (2012) https://doi.org/10.1117/12.917412
Event: SPIE Advanced Lithography, 2012, San Jose, California, United States

Abstract

In recent semiconductor manufacturing, hardmask is unavoidable requirement to further transfer the patterning from thin photoresist to underlayer. While several types of hardmask materials have been investigated, amorphous carbon has been attractive for good etching resistance and high-aspect-ratio resolution. However, it has fatal problem with lowering overlay controllability due to its high extinction coefficient (k). Thus, the correlation of alignment and overlay performance with varying hardmask materials is required to meet a tight overlay budget of 2x nm node and beyond. In this paper, we have investigated the effects of the hardmask materials with respect to the optical properties on the performance of overlay applicable to 2x nm memory devices.

Citation Download Citation

Sangho Yun, Soon Mok Ha, Young Min Nam, Cheol-Hong Kim, and Suk-Woo Nam "A comparison of alignment and overlay performance with varying hardmask materials", Proc. SPIE 8324, Metrology, Inspection, and Process Control for Microlithography XXVI, 832407 (4 April 2012); https://doi.org/10.1117/12.917412

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