Hybrid overlay metrology for high order correction by using CDSEM

Philippe Leray; Sandip Halder; Gian Lorusso; Bart Baudemprez; Osamu Inoue; Yutaka Okagawa

doi:10.1117/12.2222777

8 April 2016 Hybrid overlay metrology for high order correction by using CDSEM

Philippe Leray, Sandip Halder, Gian Lorusso, Bart Baudemprez, Osamu Inoue, Yutaka Okagawa

Proceedings Volume 9778, Metrology, Inspection, and Process Control for Microlithography XXX; 977824 (2016) https://doi.org/10.1117/12.2222777
Event: SPIE Advanced Lithography, 2016, San Jose, California, United States

Abstract

Overlay control has become one of the most critical issues for semiconductor manufacturing. Advanced lithographic scanners use high-order corrections or correction per exposure to reduce the residual overlay. It is not enough in traditional feedback of overlay measurement by using ADI wafer because overlay error depends on other process (etching process and film stress, etc.). It needs high accuracy overlay measurement by using AEI wafer. WIS (Wafer Induced Shift) is the main issue for optical overlay, IBO (Image Based Overlay) and DBO (Diffraction Based Overlay). We design dedicated SEM overlay targets for dual damascene process of N10 by i-ArF multi-patterning. The pattern is same as device-pattern locally. Optical overlay tools select segmented pattern to reduce the WIS. However segmentation has limit, especially the via-pattern, for keeping the sensitivity and accuracy. We evaluate difference between the viapattern and relaxed pitch gratings which are similar to optical overlay target at AEI. CDSEM can estimate asymmetry property of target from image of pattern edge. CDSEM can estimate asymmetry property of target from image of pattern edge. We will compare full map of SEM overlay to full map of optical overlay for high order correction ( correctables and residual fingerprints).

Citation Download Citation

Philippe Leray, Sandip Halder, Gian Lorusso, Bart Baudemprez, Osamu Inoue, and Yutaka Okagawa "Hybrid overlay metrology for high order correction by using CDSEM", Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 977824 (8 April 2016); https://doi.org/10.1117/12.2222777

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