Paper
26 June 2003 157-nm lithography for 65-nm node SRAM-gate
Author Affiliations +
Abstract
We evaluated the requirements for 65-nm SRAM gate fabrication using attenuated phase shifting masks (att-PSM). Off-axis illumination (OAI) and att-PSM, together with optical proximity correction (OPC) were used as resolution enhancement techniques (RETs) for ultimate resolution. It was shown that the photolithographic parameters of the transmittance of the att-PSM and the illumination conditions for optimum conditions were a transmittance of between 15 and 20% and 3/4 annular illumination. The exposure latitude was simulated to be more than 10.9% at 300-nm defocus for a critical dimension (CD) specification of 10%. It has been demonstrated that a 65-nm SRAM-gate, with a line and space (L/S) ratio limited to 1:2 at the minimum pitch, could be fabricated with sufficient depth of focus (DOF). The pattern transfer was accomplished with a bi-layer process, in which the reactive ion etching (RIE) selectivity between a silicon-containing resist and an organic film is very high. This bi-layer process enabled the application of a very thin resist layer. The conditions described in this paper proved successful for the fabrication of a 65-nm SRAM gate with a good pattern profile despite the resist thickness of less than 120nm.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Toshifumi Suganaga, Shigeo Irie, Seiro Miyoshi, Jae-Hwan Kim, Kunio Watanabe, Eiji Kurose, Takamitsu Furukawa, Takuya Hagiwara, Toshiyuki Ishimaru, and Toshiro Itani "157-nm lithography for 65-nm node SRAM-gate", Proc. SPIE 5040, Optical Microlithography XVI, (26 June 2003); https://doi.org/10.1117/12.485376
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KEYWORDS
Optical proximity correction

Lithography

Transmittance

Photoresist processing

Resolution enhancement technologies

Silicon

Reactive ion etching

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