Paper
10 October 2003 Uncooled micromachined bolometer arrays on flexible substrates
Author Affiliations +
Abstract
This paper reports progress on the development of micromachined infrared microsensors on flexible polymer substrates. The flexible substrates were formed by spin-coating polyimide films (HD Microsystems PI-5878G) on silicon wafer carriers. Semiconducting Yttrium Barium Copper Oxide (YBCO) was used as the thermistor. The microbolometer was fabricated using a polyimide (HD Microsystems PI2737) sacrificial mesa and titanium electrode arms. The YBCO thermistor was suspended above the substrate by the electrode arms after the sacrificial layers have been removed by micromachining. The polyimide substrate was then removed from the silicon wafer carrier to complete the fabrication of the infrared microsensors on a flexible polyimide substrate. The measured thermal conductance of the microbolometers ranged from 9.07 x 10-6 W/K for a non-micromachined to 4.0 x 10-7 W/K for a micromachined sensor. As a result, the responsivity and detectivity were measured to be as high as 6.1 x 104V/W and a 1.2 x 108 cmHz1/2/W, respectively, with a 970 nA current bias. This level of performance is comparable to similar miromachined detectors fabricated on silicon substrates.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shadi A. Dayeh, Donald P. Butler, Zeynep Celik-Butler, and Patty Wisian-Neilson "Uncooled micromachined bolometer arrays on flexible substrates", Proc. SPIE 5074, Infrared Technology and Applications XXIX, (10 October 2003); https://doi.org/10.1117/12.487293
Lens.org Logo
CITATIONS
Cited by 3 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Silicon

Sensors

Microbolometers

Resistance

Semiconducting wafers

Microsensors

Signal to noise ratio

Back to Top