Dr. Christoph K. Hohle Profile

Dr. Christoph K. Hohle

Team Manager Technology Development SLM at Fraunhofer-Institut für Photonische Mikrosysteme IPMS

SPIE Involvement:

Conference Program Committee | Author | Editor

Area of Expertise:

Patterning , Photoresists , E-Beam Lithography , MEMS / MOEMS

Websites:

Company Website

Publications (49)

Proceedings Article | 9 April 2024 Presentation + Paper

MEMS-on-CMOS integration of a holographic 8M-pixel SLM device using KrF-lithography

S. Döring, P. Recknagel, C. Hohle, P. Dürr

Proceedings Volume 12958, 1295809 (2024) https://doi.org/10.1117/12.3010154

KEYWORDS: Actuators, Optical lithography, Spatial light modulators, Lithography, Semiconducting wafers, Overlay metrology, Holography, Microelectromechanical systems, Reactive ion etching, Micromirrors

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Proceedings Article | 2 March 2022 Presentation + Paper

MEMS piston mirror arrays for computer generated holography

P. Dürr, A. Neudert, M. Nitzsche, C. Hohle, H. Stolle, J. Pleikies

Proceedings Volume 12013, 1201306 (2022) https://doi.org/10.1117/12.2608081

KEYWORDS: Actuators, Mirrors, Spatial light modulators, Microelectromechanical systems, Computer generated holography, Holography, Micromirrors, 3D displays, Finite element methods, Mixed reality

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Proceedings Article | 5 March 2021 Presentation + Paper

Challenges of monolithic MEMS-on-CMOS integration for spatial light modulators

Christoph Hohle, Sebastian Döring, Martin Friedrichs, Andreas Gehner, Dirk Rudloff, Matthias Schulze, Ronald Stübner, Daniela Trenkler

Proceedings Volume 11697, 116970V (2021) https://doi.org/10.1117/12.2583036

KEYWORDS: Microelectromechanical systems, Spatial light modulators, Semiconducting wafers, Mirrors, Lithography, Wafer-level optics, System on a chip, Surface micromachining, Optical lithography, Microopto electromechanical systems

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Proceedings Article | 28 February 2020 Paper

Novel CMOS-integrated 512x320 tip-tilt micro mirror array and related technology platform

A. Gehner, S. Döring, D. Rudloff, D. Kunze, P. Dürr, S. Francés, L. Hänsel, H. Torlee, A. Elgner, M. Eckert, M. Friedrichs, J. Heber, J. Schmidt, W. Pufe, C. Hohle, M. Schulze, M. Wagner

Proceedings Volume 11293, 1129302 (2020) https://doi.org/10.1117/12.2543052

KEYWORDS: Mirrors, Actuators, Micromirrors, Optical lithography, Calibration, Analog electronics, CMOS technology

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Proceedings Article | 21 March 2016 Paper

Evaluation of water based intelligent fluids for resist stripping in single wafer cleaning tools

Matthias Rudolph, Silvio Esche, Christoph Hohle, Dirk Schumann, Philipp Steinke, Xaver Thrun, Justus von Sonntag

Proceedings Volume 9779, 977919 (2016) https://doi.org/10.1117/12.2220156

KEYWORDS: Advanced cleaning techniques, Mask cleaning, Fluid dynamics, Microfluidics, Semiconducting wafers, Water, Silicon, Photoresist processing, Chemistry, Particles, Scanning electron microscopy, Plasma etching, Photoresist materials, Polymers, Plasma

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Proceedings Article | 8 March 2016 Paper

Patterning and imaging with electrons: assessing multi-beam SEM for e-beam structured CMOS samples

Tomasz Garbowski, Friedhelm Panteleit, Gregor Dellemann, Manuela Gutsch, Christoph Hohle, Elke Reich, Matthias Rudolph, Katja Steidel, Xaver Thrun, Dirk Zeidler

Proceedings Volume 9778, 97781V (2016) https://doi.org/10.1117/12.2225501

KEYWORDS: Electrons, Defect inspection, Semiconducting wafers, Scanning electron microscopy, Inspection, Wafer inspection, Semiconductors, Electron beams, Metals, Tin, Electron beam lithography, Image processing, Sensors

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Proceedings Article | 23 October 2015 Paper

Sensitivity analysis for high accuracy proximity effect correction

Xaver Thrun, Clyde Browning, Kang-Hoon Choi, Thiago Figueiro, Christoph Hohle, Mohamed Saib, Patrick Schiavone, Johann Bartha

Proceedings Volume 9635, 963515 (2015) https://doi.org/10.1117/12.2197175

KEYWORDS: Point spread functions, Critical dimension metrology, Algorithm development, Scattering, Calibration, Cadmium sulfide, Computer simulations, Semiconducting wafers, Photovoltaics, Electron beams

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Proceedings Article | 19 March 2015 Paper

Verification of E-Beam direct write integration into 28nm BEOL SRAM technology

Christoph Hohle, Kang-Hoon Choi, Manuela Gutsch, Norbert Hanisch, Robert Seidel, Katja Steidel, Xaver Thrun, Thomas Werner

Proceedings Volume 9423, 94231B (2015) https://doi.org/10.1117/12.2087612

KEYWORDS: Metals, Semiconducting wafers, Electron beam lithography, Etching, Electron beam direct write lithography, Photomasks, Optical alignment, Wafer-level optics, Back end of line, Electron beams

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Electron beam direct write lithography (EBDW) potentially offers advantages for low-volume semiconductor manufacturing, rapid prototyping or design verification due to its high flexibility without the need of costly masks. However, the integration of this advanced patterning technology into complex CMOS manufacturing processes remains challenging. The low throughput of today’s single e-Beam tools limits high volume manufacturing applications and maturity of parallel (multi) beam systems is still insufficient [1,2]. Additional concerns like transistor or material damage of underlying layers during exposure at high electron density or acceleration voltage have to be addressed for advanced technology nodes. In the past we successfully proved that potential degradation effects of high-k materials or ULK shrink can be neglected and were excluded by demonstrating integrated electrical results of 28nm node transistor and BEOL performance following 50kV electron beam dry exposure [3]. Here we will give an update on the integration of EBDW in the 300mm CMOS manufacturing processes of advanced integrated circuits at the 28nm SRAM node of GLOBALFOUNDRIES Dresden. The work is an update to what has been previously published [4]. E-beam patterning results of BEOL full chip metal and via layers with a dual damascene integration scheme using a 50kV VISTEC SB3050DW variable shaped electron beam direct writer at Fraunhofer IPMSCNT are demonstrated. For the patterning of the Metal layer a Mix & Match concept based on the sequence litho - etch -litho -etch (LELE) was developed and evaluated wherein several exposure fields were blanked out during the optical exposure. Etch results are shown and compared to the POR. Results are also shown on overlay performance and optimized e-Beam exposure time using most advanced data prep solutions and resist processes. The patterning results have been verified using fully integrated electrical measurement of metal lines and vias on wafer level. In summary we demonstrate the integration capability of EBDW into a productive CMOS process flow at the example of the 28nm SRAM technology node.

Proceedings Article | 17 October 2014 Paper

Integration of e-beam direct write in BEOL processes of 28nm SRAM technology node using mix and match

Manuela Gutsch, Kang-Hoon Choi, Norbert Hanisch, Christoph Hohle, Robert Seidel, Katja Steidel, Xaver Thrun, Thomas Werner

Proceedings Volume 9231, 92310F (2014) https://doi.org/10.1117/12.2067884

KEYWORDS: Metals, Etching, Semiconducting wafers, Optical alignment, Electron beam direct write lithography, Photomasks, Back end of line, Electron beam lithography, Scanning electron microscopy, Electron beams

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Proceedings Article | 17 October 2014 Paper

Innovative and water based stripping approach for thick and bulk photoresists

Matthias Rudolph, Dirk Schumann, Xaver Thrun, Silvio Esche, Christoph Hohle

Proceedings Volume 9231, 92310U (2014) https://doi.org/10.1117/12.2069941

KEYWORDS: Photoresist materials, Silicon, Microfluidics, Chemistry, Metals, Water, Semiconductors, Photoresist processing, Fluid dynamics, Plasma

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Proceedings Article | 8 October 2014 Paper

Effective corner rounding correction in the data preparation for electron beam lithography

Kang-Hoon Choi, Clyde Browning, Thiago Figueiro, Christoph Hohle, Michael Kaiser, Patrick Schiavone

Proceedings Volume 9235, 92350U (2014) https://doi.org/10.1117/12.2066156

KEYWORDS: Chromium, Electron beam lithography, Data corrections, Cadmium, Beam shaping, Neodymium, Lithography, Photoresist processing, Photomasks, Critical dimension metrology

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Proceedings Article | 27 March 2014 Paper

Introduction of an innovative water based photoresist stripping process using intelligent fluids

Matthias Rudolph, Xaver Thrun, Dirk Schumann, Anita Hoehne, Silvio Esche, Christoph Hohle

Proceedings Volume 9051, 90510T (2014) https://doi.org/10.1117/12.2048068

KEYWORDS: Silicon, Semiconducting wafers, Semiconductors, Photoresist processing, Chemistry, Water, Photoresist materials, Contamination, Particles, Microelectromechanical systems

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Proceedings Article | 1 October 2013 Paper

Extreme long range process effects characterization and compensation

Thiago Figueiro, Clyde Browning, Martin Thornton, Cyril Vannuffel, Kang-Hoon Choi, Christoph Hohle, Jean-Herve Tortai, Patrick Schiavone

Proceedings Volume 8886, 88860F (2013) https://doi.org/10.1117/12.2030664

KEYWORDS: Semiconducting wafers, Calibration, Point spread functions, Reticles, Electron beam lithography, Mathematical modeling, Chemical mechanical planarization, Modulation, Forward error correction, Metrology

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Proceedings Article | 23 September 2013 Paper

Metrology variability and its impact in process modeling

Thiago Figueiro, Mohamed Saib, Kang-Hoon Choi, Christoph Hohle, Martin Thornton, Cyril Vannufel, Jean-Hervé Tortai, Patrick Schiavone

Proceedings Volume 8880, 888020 (2013) https://doi.org/10.1117/12.2026423

KEYWORDS: Calibration, Metrology, Semiconducting wafers, Error analysis, Process modeling, Data modeling, Point spread functions, Opacity, Electron beam lithography, Statistical modeling

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Proceedings Article | 29 March 2013 Paper

Evaluation of an advanced dual hard mask stack for high resolution pattern transfer

J. Paul, M. Rudolph, S. Riedel, X. Thrun, S. Wege, C. Hohle

Proceedings Volume 8685, 86850V (2013) https://doi.org/10.1117/12.2018247

KEYWORDS: Zirconium dioxide, Etching, Silicon, Photomasks, Silica, Optical lithography, Atomic layer deposition, Surface roughness, Crystals, Plasma

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Proceedings Article | 29 March 2013 Paper

Effects on electron scattering and resist characteristics using assisting underlayers for e-beam direct write lithography

Xaver Thrun, Kang-Hoon Choi, Norbert Hanisch, Christoph Hohle, Katja Steidel, Douglas Guerrero, Thiago Figueiro, Johann Bartha

Proceedings Volume 8682, 86820Z (2013) https://doi.org/10.1117/12.2011461

KEYWORDS: Silicon, Semiconducting wafers, System on a chip, Aluminum, Titanium, Scattering, Point spread functions, Metals, Neodymium, Electron beam lithography

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Proceedings Article | 26 March 2013 Paper

Influence of high-energy electron irradiation on ultra-low-k characteristics and transistor performance

Katja Steidel, Kang-Hoon Choi, Martin Freitag, Manuela Gutsch, Christoph Hohle, Robert Seidel, Xaver Thrun, Thomas Werner

Proceedings Volume 8680, 86801A (2013) https://doi.org/10.1117/12.2011467

KEYWORDS: Back end of line, Transistors, Semiconducting wafers, Dielectrics, Oxides, Resistance, Copper, Electron beam lithography, Capacitance, Metals

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Proceedings Article | 8 November 2012 Paper

Advanced module for model parameter extraction using global optimization and sensitivity analysis for electron beam proximity effect correction

Thiago Figueiro, Kang-Hoon Choi, Manuela Gutsch, Martin Freitag, Christoph Hohle, Jean-Hervé Tortai, Mohamed Saib, Patrick Schiavone

Proceedings Volume 8522, 852212 (2012) https://doi.org/10.1117/12.965312

KEYWORDS: Calibration, Point spread functions, Data modeling, Optimization (mathematics), Semiconducting wafers, Electron beams, Beam analyzers, Metrology, Photoresist processing, Electron beam lithography

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Proceedings Article | 21 March 2012 Paper

Feasibility study of optical/e-beam complementary lithography

Christoph Hohle, Kang-Hoon Choi, Martin Freitag, Manuela Gutsch, Philipp Jaschinsky, Frank Kahlenberg, Christof Klein, Jan Klikovits, Jan Paul, Matthias Rudolph, Xaver Thrun

Proceedings Volume 8323, 83232C (2012) https://doi.org/10.1117/12.916386

KEYWORDS: Etching, Lithography, Electron beam lithography, Silicon, Semiconducting wafers, Photomasks, 193nm lithography, Electron beam direct write lithography, Beam shaping, Optics manufacturing

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Proceedings Article | 19 March 2012 Paper

Demonstration of 22nm SRAM features with patternable hafnium oxide-based resist material using electron-beam lithography

Xaver Thrun, Kang-Hoon Choi, Martin Freitag, Andrew Grenville, Manuela Gutsch, Christoph Hohle, Jason Stowers, Johann Bartha

Proceedings Volume 8325, 832518 (2012) https://doi.org/10.1117/12.917814

KEYWORDS: Semiconducting wafers, Oxides, Hafnium, Electron beam lithography, Photomasks, Electron beams, Metals, Etching, Scanning electron microscopy, Manufacturing

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Proceedings Article | 14 October 2011 Paper

Efficient large volume data preparation for electron beam lithography for sub-45nm node

Kang-Hoon Choi, Manuela Gutsch, Martin Freitag, Christoph Hohle, Luc Martin, Sebastien Bayle, Serdar Manakli, Patrick Schiavone

Proceedings Volume 8166, 816621 (2011) https://doi.org/10.1117/12.897586

KEYWORDS: Modulation, Electron beam lithography, Cadmium sulfide, Algorithm development, Point spread functions, Metals, Data corrections, Photomasks, Critical dimension metrology, Optics manufacturing

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SPIE Journal Paper | 1 October 2011

Fast characterization of line end shortening and application of novel correction algorithms in e-beam direct write

Martin Freitag, Kang-Hoon Choi, Manuela Gutsch, Christoph Hohle, Reinhard Galler, Michael Krüger, Ulf Weidenmüller

JM3, Vol. 10, Issue 04, 043012, (October 2011) https://doi.org/10.1117/12.10.1117/1.3659145

KEYWORDS: Cadmium, Semiconducting wafers, Computer simulations, Electron beams, Detection and tracking algorithms, Electron beam lithography, Point spread functions, Model-based design, Modulation, Nanoelectronics

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Proceedings Article | 4 April 2011 Paper

Fast characterization of line-end shortening and application of novel correction algorithms in e-beam direct write

Martin Freitag, Kang-Hoon Choi, Manuela Gutsch, Christoph Hohle, Reinhard Galler, Michael Krüger, Ulf Weidenmueller

Proceedings Volume 7970, 79701C (2011) https://doi.org/10.1117/12.879582

KEYWORDS: Cadmium sulfide, Computer simulations, Semiconducting wafers, Electron beam lithography, Electron beams, Detection and tracking algorithms, Point spread functions, Electron beam direct write lithography, Modulation, Nanoelectronics

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Proceedings Article | 2 April 2011 Paper

Geometrically induced dose correction: method and performance results

R. Galler, K.-H. Choi, M. Gutsch, C. Hohle, M. Krueger, L. Ramos, M. Suelzle, U. Weidenmueller

Proceedings Volume 7985, 79850S (2011) https://doi.org/10.1117/12.895205

KEYWORDS: Electron beam lithography, Line edge roughness, Cadmium sulfide, Photoresist processing, Chemically amplified resists, Cadmium, Scattering, Backscatter, Lithography, Modulation

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Proceedings Article | 2 April 2011 Paper

Line end shortening and application of novel correction algorithms in e-beam direct write

Martin Freitag, Kang-Hoon Choi, Manuela Gutsch, Christoph Hohle

Proceedings Volume 7985, 79850T (2011) https://doi.org/10.1117/12.891127

KEYWORDS: Semiconducting wafers, Computer simulations, Cadmium, Modulation, Detection and tracking algorithms, Electron beam lithography, Electron beams, Electron beam direct write lithography, Point spread functions, Nanoelectronics

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Proceedings Article | 25 September 2010 Paper

Geometrically induced dose correction method for e-beam lithography applications

R. Galler, K.-H. Choi, M. Gutsch, C. Hohle, M. Krueger, L. E. Ramos, M. Suelzle, U. Weidenmueller

Proceedings Volume 7823, 78231E (2010) https://doi.org/10.1117/12.864263

KEYWORDS: Electron beam lithography, Line edge roughness, Cadmium sulfide, Scattering, Laser scattering, Convolution, Photoresist processing, Modulation, Chemically amplified resists, Electron beams

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Proceedings Article | 3 April 2010 Paper

Conventional and reversed image printing in electron beam direct write lithography with proximity effect corrections based on dose and shape modification

Kang-Hoon Choi, Manuela Gutsch, Martin Freitag, Katja Keil, Philipp Jaschinsky, Christoph Hohle

Proceedings Volume 7637, 76370W (2010) https://doi.org/10.1117/12.846514

KEYWORDS: Electron beam direct write lithography, Cadmium sulfide, Image processing, Printing, Line width roughness, Line edge roughness, Electron beams, Point spread functions, Photoresist processing, Metrology

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Proceedings Article | 27 May 2009 Paper

Design verification for sub-70-nm DRAM nodes via metal fix using E-beam direct write

K. Keil, P. Jaschinsky, C. Hohle, K.-H. Choi, R. Schneider, M. Tesauro, F. Thrum, R. Zimmermann, J. Kretz

Proceedings Volume 7470, 747017 (2009) https://doi.org/10.1117/12.835206

KEYWORDS: Metals, Electron beam direct write lithography, Semiconducting wafers, Photomasks, Electron beam lithography, Wafer-level optics, Integrated optics, Etching, Reticles, Printing

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Proceedings Article | 18 March 2009 Paper

PML2: the maskless multibeam solution for the 22nm node and beyond

C. Klein, E. Platzgummer, J. Klikovits, W. Piller, H. Loeschner, T. Bejdak, P. Dolezel, V. Kolarik, W. Klingler, F. Letzkus, J. Butschke, M. Irmscher, M. Witt, W. Pilz, P. Jaschinsky, F. Thrum, C. Hohle, J. Kretz, J. Nogatch, A. Zepka

Proceedings Volume 7271, 72710N (2009) https://doi.org/10.1117/12.813670

KEYWORDS: Semiconducting wafers, Lithography, Electron beams, Electrodes, Prototyping, Electron beam lithography, Electron beam direct write lithography, Silicon, Optical alignment, Photomasks

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Proceedings Article | 18 March 2009 Paper

Fabrication of metrology test structures for future technology nodes using high-resolution variable-shaped e-beam direct write

László Szikszai, Philipp Jaschinsky, Katja Keil, Marc Hauptmann, Manfred Mört, Uwe Seifert, Christoph Hohle, Kang-Hoon Choi, Frank Thrum, Johannes Kretz, Vaeriano Ferreras Paz, Arie den Boef

Proceedings Volume 7271, 72712M (2009) https://doi.org/10.1117/12.814181

KEYWORDS: Scatterometry, Metrology, Line edge roughness, Critical dimension metrology, Line width roughness, Semiconducting wafers, Electron beams, Electron beam direct write lithography, Lithography, Cadmium

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Proceedings Article | 2 May 2008 Paper

Printing of sub-resolution shots in electron beam direct write with variable shaped beam machines

Frank Thrum, Johannes Kretz, Christoph Hohle, Kang-Hoon Choi, Katja Keil

Proceedings Volume 6792, 67920B (2008) https://doi.org/10.1117/12.798585

KEYWORDS: Scanning electron microscopy, Printing, Image resolution, Beam shaping, Calibration, Electron beams, Photoresist processing, Photomasks, Magnesium, Nanoelectronics

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Proceedings Article | 28 March 2008 Paper

MAGIC: a European program to push the insertion of maskless lithography

L. Pain, B. Icard, S. Tedesco, B. Kampherbeek, G. Gross, C. Klein, H. Loeschner, E. Platzgummer, R. Morgan, S. Manakli, J. Kretz, C. Holhe, K.-H. Choi, F. Thrum, E. Kassel, W. Pilz, K. Keil, J. Butschke, M. Irmscher, F. Letzkus, P. Hudek, A. Paraskevopoulos, P. Ramm, J. Weber

Proceedings Volume 6921, 69211S (2008) https://doi.org/10.1117/12.772472

KEYWORDS: Semiconducting wafers, Lithography, Photomasks, Manufacturing, Electron beams, Electron beam lithography, Nanofabrication, Computed tomography, Prototyping, Maskless lithography

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Proceedings Article | 28 March 2008 Paper

High throughput maskless lithography: low voltage versus high voltage

S. W. H. Steenbrink, B. Kampherbeek, M. Wieland, J. Chen, S. Chang, M. Pas, J. Kretz, C. Hohle, D. van Steenwinckel, S. Manakli, J. Le-Denmat, L. Pain

Proceedings Volume 6921, 69211T (2008) https://doi.org/10.1117/12.771971

KEYWORDS: Semiconducting wafers, Scattering, Silicon, Critical dimension metrology, Electron beam lithography, Laser scattering, Lenses, Lithography, Modulation transfer functions, Maskless lithography

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Proceedings Article | 20 March 2008 Paper

Gate edge roughness in electron beam direct write and its influence to device characteristics

Kang-Hoon Choi, Rok Dittrich, Matthias Goldbach, Christoph Hohle, Katja Keil, Thomas Marschner, Mark Tesauro, Frank Thrum, Roy Zimmermann, Johannes Kretz

Proceedings Volume 6921, 69210J (2008) https://doi.org/10.1117/12.772649

KEYWORDS: Line edge roughness, Line width roughness, Electron beam direct write lithography, Amplifiers, Metrology, Cadmium, Electron beams, Lithography, Critical dimension metrology, Modulation

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Proceedings Article | 15 March 2007 Paper

Defect inspection of positive and negative sub-60nm resist pattern printed with variable shaped e-beam direct write lithography

C. Arndt, C. Hohle, J. Kretz, T. Lutz, M. Richter, K. Keil, M. Lapidot, D. Zemach, M. Kindler

Proceedings Volume 6517, 651711 (2007) https://doi.org/10.1117/12.712078

KEYWORDS: Inspection, Semiconducting wafers, Particles, Photoresist processing, Defect inspection, Scanning electron microscopy, Electron beam lithography, Electron beams, Process control, Coating

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Proceedings Article | 29 March 2006 Paper

Evaluation of most recent chemically amplified resists for high resolution direct write using a Leica SB350 variable shaped beam writer

Anatol Schwersenz, Dirk Beyer, Monika Boettcher, Kang-Hoon Choi, Ulrich Denker, Christoph Hohle, Mathias Irmscher, Frank-Michael Kamm, Karl-Heinz Kliem, Johannes Kretz, Holger Sailer, Frank Thrum

Proceedings Volume 6153, 615347 (2006) https://doi.org/10.1117/12.655497

KEYWORDS: Semiconducting wafers, Photomasks, Optical lithography, Chemically amplified resists, Photoresist processing, Electron beam lithography, Beam shaping, Prototyping, Coating, Lithography

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SPIE Journal Paper | 1 October 2005

Surface roughness investigation of 157- and 193-nm polymer platforms using different etch conditions

Christoph Hohle, Nicole Heckmann, Michael Sebald, Matthias Markert, Nickolay Stepanenko, Francis Houlihan, Andrew Romano, Raj Sakamuri, David Rentkiewicz, Ralph Dammel

JM3, Vol. 4, Issue 04, 043009, (October 2005) https://doi.org/10.1117/12.10.1117/1.2131101

KEYWORDS: Etching, Polymers, Surface roughness, Fluorine, Plasmas, Scanning electron microscopy, Resistance, Oxides, Plasma etching, Chlorine

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Proceedings Article | 4 May 2005 Paper

Study of 157 nm resists with full field exposure tools

Yayi Wei, Nickolay Stepanenko, Michael Sebald, Christoph Hohle, Francis Houlihan, Raj Sakamuri, Alla Dimerli, Andrew Romano, Ralph Dammel

Proceedings Volume 5753, (2005) https://doi.org/10.1117/12.601811

KEYWORDS: Thin film coatings, Coating, Binary data, Photomasks, Lithography, Phase shifts, Semiconducting wafers, Contamination, Deep ultraviolet, Absorbance

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Proceedings Article | 4 May 2005 Paper

Study of barrier coats for protection against airborne contamination in 157-nm lithography

Francis Houlihan, Raj Sakamuri, Keino Hamilton, Alla Dimerli, David Rentkiewicz, Andrew Romano, Ralph Dammel, Yayi Wei, Nickolay Stepanenko, Michael Sebald, Christoph Hohle, Will Conley, Daniel Miller, Toshiro Itani, Masato Shigematsu, Etsuro Kawaguchi

Proceedings Volume 5753, (2005) https://doi.org/10.1117/12.601810

KEYWORDS: Thin film coatings, Coating, Contamination, Scanning electron microscopy, Semiconducting wafers, Binary data, Photomasks, Lithography, Deep ultraviolet, Phase shifts

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Proceedings Article | 14 May 2004 Paper

Recent advances in fluorinated resists for application at 157 nm

Francis Houlihan, Raj Sakamuri, Andrew Romano, David Rentkiewicz, Ralph Dammel, Willard Conley, Daniel Miller, Michael Sebald, Nickolay Stepanenko, Matthias Markert, Uta Mierau, Inge Vermeir, Christoph Hohle, Toshiro Itani, Masato Shigematsu, Etsurou Kawaguchi

Proceedings Volume 5376, (2004) https://doi.org/10.1117/12.537541

KEYWORDS: Transparency, Etching, Absorbance, Photomasks, Lithography, Resistance, Pellicles, Binary data, Silicon, Polymers

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Proceedings Article | 24 July 2002 Paper

Ultrathin film imaging at 157 nm

Joerg Rottstegge, Waltraud Herbst, Stefan Hien, Gerald Fuetterer, Christian Eschbaumer, Christoph Hohle, Johannes Schwider, Michael Sebald

Proceedings Volume 4690, (2002) https://doi.org/10.1117/12.474249

KEYWORDS: Silicon, Etching, Polymers, Photoresist processing, Resistance, Photomasks, Polymer thin films, Lithography, Plasma, Thin films

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Proceedings Article | 24 July 2002 Paper

Novel fluoro copolymers for 157-nm photoresists: a progress report

Christoph Hohle, Stefan Hien, Christian Eschbaumer, Joerg Rottstegge, Michael Sebald

Proceedings Volume 4690, (2002) https://doi.org/10.1117/12.474252

KEYWORDS: Polymers, Absorbance, Silicon, Photoresist materials, Vacuum ultraviolet, Photoresist processing, Transparency, Phase shifts, Etching, Photoresist developing

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Proceedings Article | 13 November 2000 Paper

Variation of the glass transition temperature in organic photorefractive materials: plasticizer versus novel synthetic approaches

Andre Leopold, Uwe Hofmann, M. Grasruck, Stephan Zilker, Dietrich Haarer, Jolita Ostrauskaite, Juozas Grazulevicius, Mukundan Thelakkat, Christoph Hohle, Peter Strohriegl, Hans-Werner Schmidt, Andreas Bacher, Donal Bradley, M. Redecker, Michael Inbasekaran, Weishi Wu, Edmund Woo

Proceedings Volume 4104, (2000) https://doi.org/10.1117/12.406472

KEYWORDS: Glasses, Chromophores, Molecules, Refractive index, Holography, Modulation, Polymers, Telescopic pixel displays, Photoresistors, Information operations

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Proceedings Article | 13 November 2000 Paper

Amorphous monolithic triphenylamine derivatives with fast holographic response times

Christoph Hohle, Peter Strohriegl, Stephan Zilker, Dietrich Haarer

Proceedings Volume 4104, (2000) https://doi.org/10.1117/12.406470

KEYWORDS: Glasses, Holography, Chromophores, Refractive index, Modulation, Crystals, Molecules, Nonlinear optics, Optical storage, Image processing

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Proceedings Article | 11 October 1999 Paper

Bifunctional cyclosiloxanes with photorefractive properties

Christoph Hohle, Peter Strohriegl, Uwe Hofmann, Dietrich Haarer

Proceedings Volume 3796, (1999) https://doi.org/10.1117/12.368295

KEYWORDS: Polymers, Glasses, Chromophores, Crystals, Electro optics, Modulation, Refractive index, Nonlinear optics, Platinum, Chromatography

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Proceedings Article | 5 October 1999 Paper

Build-up dynamics of fast organic photorefractive glasses

Uwe Hofmann, M. Grasruck, Andre Leopold, Andreas Schreiber, Stefan Schloter, Stephan Zilker, Dietrich Haarer, Mukundan Thelakkat, Christoph Hohle, Hans-Werner Schmidt, Peter Strohriegl

Proceedings Volume 3799, (1999) https://doi.org/10.1117/12.363917

KEYWORDS: Glasses, Composites, Refractive index, Modulation, Holography, Molecules, Diffraction, Chromophores, Information operations, Doping

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Proceedings Article | 23 October 1998 Paper

Synthesis and characterization of novel photorefractive low molecular weight glasses

Christoph Hohle, Peter Strohriegl, Stefan Schloter, Uwe Hofmann, Dietrich Haarer

Proceedings Volume 3471, (1998) https://doi.org/10.1117/12.328172

KEYWORDS: Glasses, Diffraction, Crystals, Modulation, Refractive index, Diffraction gratings, Chromophores, Potassium, Nonlinear optics, Four wave mixing

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Proceedings Article | 9 October 1997 Paper

New photorefractive polymers for real-time holography

Stefan Schloter, Uwe Hofmann, Rainer Hagen, Christoph Hohle, Kai Ewert, Peter Strohriegl, C.-D. Eisenbach, Hans-Werner Schmidt, Dietrich Haarer

Proceedings Volume 3144, (1997) https://doi.org/10.1117/12.290234

KEYWORDS: Chromophores, Polymers, Holography, Glasses, Polymethylmethacrylate, Molecules, Electro optics, Nonlinear optics, Photorefractive polymers, Diffraction

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Proceedings Article | 9 October 1997 Paper

Synthetic approaches to photorefractive polymers and low-molar-mass glasses

Christoph Hohle, M. Eckl, Uwe Hofmann, Stefan Schloter, Dietrich Haarer, Peter Strohriegl

Proceedings Volume 3144, (1997) https://doi.org/10.1117/12.290233

KEYWORDS: Glasses, Polymers, Chromophores, Molecules, Crystals, Photorefractive polymers, Photoresistors, Holography, Nonlinear optics, Light emitting diodes

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Showing 5 of 49 publications

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Advances in Patterning Materials and Processes XXXV

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SPIE Conference Volume | 23 April 2015

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SPIE Conference Volume | 16 April 2014

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Conference Committee Involvement (20)

Advances in Patterning Materials and Processes XLII

23 February 2025 | San Jose, California, United States

Advances in Patterning Materials and Processes XLI

26 February 2024 | San Jose, California, United States

Advances in Patterning Materials and Processes XL

27 February 2023 | San Jose, California, United States

Advances in Patterning Materials and Processes XXXIX

25 April 2022 | San Jose, California, United States

Advances in Patterning Materials and Processes XXXVIII

22 February 2021 | Online Only, California, United States

Advances in Patterning Materials and Processes XXXVII

24 February 2020 | San Jose, California, United States

Advances in Patterning Materials and Processes XXXVI

25 February 2019 | San Jose, California, United States

Advances in Patterning Materials and Processes XXXV

27 February 2018 | San Jose, California, United States

Advances in Patterning Materials and Processes XXXIV

28 February 2017 | San Jose, California, United States

Advances in Patterning Materials and Processes XXXIII

29 February 2016 | San Jose, California, United States

Advances in Patterning Materials and Processes XXXII

24 February 2015 | San Jose, California, United States

Advances in Patterning Materials and Processes XXXI

24 February 2014 | San Jose, California, United States

Advances in Resist Materials and Processing Technology XXX

25 February 2013 | San Jose, California, United States

Advances in Resist Materials and Processing Technology XXIX

13 February 2012 | San Jose, California, United States

Advances in Resist Materials and Processing Technology XXVIII

28 February 2011 | San Jose, California, United States

Advances in Resist Materials and Processing Technology XXVII

22 February 2010 | San Jose, California, United States

Advances in Resist Materials and Processing Technology XXVI

23 February 2009 | San Jose, California, United States

Advances in Resist Materials and Processing Technology XXV

25 February 2008 | San Jose, California, United States

Advances in Resist Materials and Processing Technology XXIV

26 February 2007 | San Jose, California, United States

Advances in Resist Materials and Processing Technology XXIII

20 February 2006 | San Jose, California, United States

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