Dr. Daniil Karnaushenko Profile

Dr. Daniil Karnaushenko

at Leibniz IFW Dresden

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 10 September 2019 Presentation

Shapeable material technologies: 3D magnetoelectronics (Conference Presentation)

Daniil Karnaushenko, Christian Becker

Proceedings Volume 11090, 110903P (2019) https://doi.org/10.1117/12.2528732

KEYWORDS: Spintronics, Electronic components, Manufacturing, Microelectronics, Fabrication, Magnetic sensors, Materials processing, System integration, Capacitors, Sensors

Read Abstract +

Electronic devices are continually evolving to offer improved performance, smaller sizes, lower weight, and reduced costs, often requiring state of the art manufacturing and materials to do so. An emerging class of materials and fabrication techniques, inspired by self-assembling biological systems shows promise as an alternative to the more traditional methods that are currently used in the microelectronics industry. Mimicking unique features of natural systems, namely flexibility and shapeability, the geometry of initially planar microelectronic structures can be tailored. Heavily relying on cylindrical geometry, fabrication of RF components as well as magnetic sensors is challenging, when conventional fabrication techniques are applied. Involving novel self-assembly strategies realization of these spatially non-trivial devices in a compact form and with a reduced number of fabrication steps become feasible. This spatial self-assembly process, triggered by an external stimulus, offers a possibility of an improved performance while reducing overall manufacturing complexity of devices and components by harnessing the relative ease in which it can produce mesoscopic 3D geometries such as a “Swiss-roll” architecture. These benefits can lead to system integration of electronic and magnetoelectronic components including circuits, capacitors, coils, sensors and antennas with reduced costs fabricated from a single wafer.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years