Dr. Thomas L. Haslett Profile

Dr. Thomas L. Haslett

Chief Technology Officer at Avo Photonics Inc

SPIE Involvement:

Conference Program Committee | Author

Publications (5)

Proceedings Article | 13 March 2024 Presentation

Automated die bonding of photonic chips

Tom Haslett, Stephen Peduto, Richard Lodge

Proceedings Volume PC12866, PC128660E (2024) https://doi.org/10.1117/12.3003281

KEYWORDS: Laser bonding, Semiconductor lasers, Reliability, Microelectromechanical systems

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Proceedings Article | 12 July 2023 Open Access

Micro-non-planar ring oscillator master oscillator for the NASA LISA laser transmitter

Anthony Yu, Kenji Numata, Scott Merritt, Bryan Nelsen, David Demmer, Jonathan Goettler, Tom Haslett, Thomas Kane

Proceedings Volume 12777, 1277747 (2023) https://doi.org/10.1117/12.2690676

KEYWORDS: Oscillators, Astronomical imaging, Nanoimprint lithography, Transmitters

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Proceedings Article | 5 March 2021 Presentation

Second-generation fluorescent nuclear track detector reader

Lukasz Maksymiuk, David Demmer, Ryan Ehid, Vasiliy Fomenko, Jonathan Harrison, Marc Million, Thomas Haslett, Mark Akselrod

Proceedings Volume 11693, 116930A (2021) https://doi.org/10.1117/12.2578784

KEYWORDS: Sensors, Image quality, Raster graphics, Radiation dosimetry, Photons, Particles, Packaging, Optical components, Optical alignment, Medical research

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Proceedings Article | 14 March 2018 Presentation

Opto-electronic packaging of fiber-coupled systems (Conference Presentation)

Sven Mahnkopf, Tom Haslett, Apurva Jain

Proceedings Volume 10513, 105130A (2018) https://doi.org/10.1117/12.2287956

KEYWORDS: Packaging, Optoelectronic packaging, Optical design, Fiber couplers, Optical components, Laser packaging, Reliability, Semiconductor lasers

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Proceedings Article | 27 February 2017 Presentation + Paper

Optoelectronic packaging of single photon avalanche diodes

S. Mahnkopf, A. Giudice, D. Demmer, T. Haslett, G. Simmerle

Proceedings Volume 10085, 100850C (2017) https://doi.org/10.1117/12.2255556

KEYWORDS: Single photon, Avalanche photodiodes, Packaging, Fiber couplers, Optoelectronic packaging, Photodetectors, Laser components, Optical design, Silicon, Multimode fibers, Tolerancing, Sensors

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Conference Committee Involvement (2)

Components and Packaging for Laser Systems XI

25 January 2025 | San Francisco, California, United States

Components and Packaging for Laser Systems X

29 January 2024 | San Francisco, California, United States

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