This paper will present a novel method of how to generate a complete profile of components for any particular design. The component checking flow need to be completed within hours so it will have very little impact on the tape-out time. A pre-layer checking method is also run to group commonly used layers for different electrical components and then employ different layout profiling flows. The foundry does this design chip analysis in order to find potentially weak devices due to their size or special size requirements for particular electrical components. The foundry can then take pre-emptive action to avoid yield loss or make an unnecessary mask for new incoming products before fab processing starts. |
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Molybdenum
Profiling
Data processing
Information operations
Excel
Manufacturing
Photoacoustic tomography