Study of acicular defects in the post-exposure bake process airborne molecular contamination

Yuan Hsu; David Wang; Miky Yeh

doi:10.1117/12.3009744

9 April 2024 Study of acicular defects in the post-exposure bake process airborne molecular contamination

Yuan Hsu, David Wang, Miky Yeh

Proceedings Volume 12957, Advances in Patterning Materials and Processes XLI; 129571I (2024) https://doi.org/10.1117/12.3009744
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

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Abstract

As technical advances continue, the pattern size of semiconductor circuits has shrunk. Defect control becomes tighter due to a decrease in defect size, which affects the image printed on the wafer. It is critical to the photomask, which contained a considerably shrunk circuit and an ultra-high-density pattern. In this paper, we introduce a study of acicular defects in Post-Exposure Bake (PEB) process Airborne Molecular Contamination (AMC). Environment AMC impact masks before and during the PEB process generate a unique defect we call an acicular defect. Based on the experiment results, we will apply different Chemically Amplified Resist (CAR) to different contaminated conditions, which produce varied phenomena including shape and distribution. An appropriate solution to mitigate defects caused by AMC of the PEB process will be proposed.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Yuan Hsu, David Wang, and Miky Yeh "Study of acicular defects in the post-exposure bake process airborne molecular contamination", Proc. SPIE 12957, Advances in Patterning Materials and Processes XLI, 129571I (9 April 2024); https://doi.org/10.1117/12.3009744

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