Deep ion-beam lithography for micromachining applications

Stuart Victor Springham; Thomas Osipowicz; J. L. Sanchez; Sing Lee; Frank Watt

doi:10.1117/12.280533

14 August 1997 Deep ion-beam lithography for micromachining applications

Stuart Victor Springham, Thomas Osipowicz, J. L. Sanchez, Sing Lee, Frank Watt

Proceedings Volume 3183, Microlithographic Techniques in IC Fabrication; (1997) https://doi.org/10.1117/12.280533
Event: ISMA '97 International Symposium on Microelectronics and Assembly, 1997, Singapore, Singapore

Abstract

LIGA and its defining process deep x-ray lithography, is an important method for machining high-aspect ratio microstructures, and a diverse range of applications are presently being investigated. One limitation of the technique is associated with the restriction on the 3D shape of the machined structures to essentially prismatic geometry. Further technical problems concerning the fabrication of a suitable mask for deep x-ray lithography are associated with the limited thickness of resist which can be patterned using electron beam lithography, and the undesirable exposure of resist by secondary radiations in an intervening x-ray lithography step which is used to produce a thicker mask. A deep lithography process using a focused beam of high energy light ions has the potential to overcome many of the geometrical restrictions inherent in deep x-ray lithography. An alternative use of deep ion bema lithography is to pattern a thick resist layer for the production of masks for deep x-ray lithography. This paper reports progress on the development of a system for deep ion bema lithography using a scanned 2.0 MeV proton beam of approximately 1 micron diameter. The result of computer simulations of the capabilities of deep ion beam lithography for the fabrication of thick DXL masks is presented.

Citation Download Citation

Stuart Victor Springham, Thomas Osipowicz, J. L. Sanchez, Sing Lee, and Frank Watt "Deep ion-beam lithography for micromachining applications", Proc. SPIE 3183, Microlithographic Techniques in IC Fabrication, (14 August 1997); https://doi.org/10.1117/12.280533

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available