Integrated packaging concept for an intelligent transducer

Matthias Heschel; J. F. Kuhmann; Siebe Bouwstra; M. Amskov

doi:10.1117/12.320187

20 July 1998 Integrated packaging concept for an intelligent transducer

Matthias Heschel, J. F. Kuhmann, Siebe Bouwstra, M. Amskov

Proceedings Volume 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS; (1998) https://doi.org/10.1117/12.320187
Event: 5th Annual International Symposium on Smart Structures and Materials, 1998, San Diego, CA, United States

Abstract

In this paper we present a stacking technology for an integrated packaging of an intelligent transducer which is formed by a micromachined silicon transducer and an integrated circuit chip. Transducer and circuitry are stacked on top of each other with an intermediate chip in between. The bonding of the transducer and the intermediate chip is done by flip chip solder bump bonding. The bonding between the above two-layer stack and the circuit chip is done by conductive adhesive bonding combined with gold studs. We demonstrate the stacking technologies on passive test chips rather than real devices and report on technological details.

Citation Download Citation

Matthias Heschel, J. F. Kuhmann, Siebe Bouwstra, and M. Amskov "Integrated packaging concept for an intelligent transducer", Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998); https://doi.org/10.1117/12.320187

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available